| Presentation | 1993/10/18 Optimazation of MCM thin film conductive layer structure substrate Takahito Nakazawa, Junichi Ohno, Yoshitaka Fukuoka, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Recently,multichip module(MCM)with copper polyimide multilayer substrate has increasing interest in application field for high- end electric products.Nevertheless,polyimide causes poor bondability as compared with surface metal layer structure of conventional co-fired ceramic substrate. This paper shows optimization of surface metal layer structure by using " design of experiments″ for copper polyimide substrate. Furthermore,wire bonding condition has been optimized to realize fine pad pitch bonding. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | copper polyimide substrate / fine pitch wire bonding / design of experiments |
| Paper # | CPM93-78 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 1993/10/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
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| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Optimazation of MCM thin film conductive layer structure substrate |
| Sub Title (in English) | |
| Keyword(1) | copper polyimide substrate |
| Keyword(2) | fine pitch wire bonding |
| Keyword(3) | design of experiments |
| 1st Author's Name | Takahito Nakazawa |
| 1st Author's Affiliation | Electronic Package & Assembly Development center,Semiconductor Group,Toshiba Corp.() |
| 2nd Author's Name | Junichi Ohno |
| 2nd Author's Affiliation | Electronic Package & Assembly Development center,Semiconductor Group,Toshiba Corp. |
| 3rd Author's Name | Yoshitaka Fukuoka |
| 3rd Author's Affiliation | Electronic Package & Assembly Development center,Semiconductor Group,Toshiba Corp. |
| Date | 1993/10/18 |
| Paper # | CPM93-78 |
| Volume (vol) | vol.93 |
| Number (no) | 275 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |