| Presentation | 1993/10/18 New Photosensitive Adhesive Resin Interconnection Technology for Chip-on-Glass Koji Matsui, Kazuaki Utsumi, Hiroshi Ohkubo, Chouei Sugitani, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The authors have developed a new COG(Chip-on-Glass)technology interconnection PARI(Photosensitive Adhesive Resin Interconnection) technology,in which an LSI chip is electrically and mechanically connected to glass substrate like a sticker in a moment using indium bumps fromed selectively on electrode pads of an LSI chip and adhesive portions formed by new photosensitive adhesive between both electrode pads. With this new PARI technology 50μm pitch electrode pads of drive r LSIs can be bonded to ITO electrode terminals on an LCD panel at low temperature(less than 150℃). |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | LCD / COG / fine pitch interconnection / photosensitive adhesive resin / indium bump |
| Paper # | CPM93-77 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1993/10/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | New Photosensitive Adhesive Resin Interconnection Technology for Chip-on-Glass |
| Sub Title (in English) | |
| Keyword(1) | LCD |
| Keyword(2) | COG |
| Keyword(3) | fine pitch interconnection |
| Keyword(4) | photosensitive adhesive resin |
| Keyword(5) | indium bump |
| 1st Author's Name | Koji Matsui |
| 1st Author's Affiliation | Material Development Center,NEC Corporation() |
| 2nd Author's Name | Kazuaki Utsumi |
| 2nd Author's Affiliation | Material Development Center,NEC Corporation |
| 3rd Author's Name | Hiroshi Ohkubo |
| 3rd Author's Affiliation | Color LCD Division,NEC Corporation |
| 4th Author's Name | Chouei Sugitani |
| 4th Author's Affiliation | Color LCD Division,NEC Corporation |
| Date | 1993/10/18 |
| Paper # | CPM93-77 |
| Volume (vol) | vol.93 |
| Number (no) | 275 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |