| Presentation | 1993/10/18 Fabrication of fine pitch solder bumps by electroplating Soichi Honma, Hiroshi Yamada, Takeshi Miyagi, Masayuki Saito, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Fine pitch solder bumps have been developed by electroplating. Electroplating can realize the formation of fine pitch and high aspect ratio bumps.Solder composition and the interconnection reliability have great importance on a flip chip assemble technique.In this paper,the way of controlling tin-lead solder composition is researched using an electrochemical analysis.The tin composition was controlled within plus minus five percent difference and the interconnection reliability was improved using a thick copper pad on a silicon substrate. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Electroplating / Solder / Bump / Composition / Reliability / Electrochemical |
| Paper # | CPM93-76 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 1993/10/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Fabrication of fine pitch solder bumps by electroplating |
| Sub Title (in English) | |
| Keyword(1) | Electroplating |
| Keyword(2) | Solder |
| Keyword(3) | Bump |
| Keyword(4) | Composition |
| Keyword(5) | Reliability |
| Keyword(6) | Electrochemical |
| 1st Author's Name | Soichi Honma |
| 1st Author's Affiliation | Research and Development Center,Toshiba Corporation() |
| 2nd Author's Name | Hiroshi Yamada |
| 2nd Author's Affiliation | Research and Development Center,Toshiba Corporation |
| 3rd Author's Name | Takeshi Miyagi |
| 3rd Author's Affiliation | Research and Development Center,Toshiba Corporation |
| 4th Author's Name | Masayuki Saito |
| 4th Author's Affiliation | Research and Development Center,Toshiba Corporation |
| Date | 1993/10/18 |
| Paper # | CPM93-76 |
| Volume (vol) | vol.93 |
| Number (no) | 275 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |