| Presentation | 1993/10/18 Electroless solder plating as a new solder supplying process for TCP assembly Minoru Fujita, Yoshiyuki Morihiro, Toshifumi Kimura, Kouhei Murakami, Shinji Badono, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Electroless solder plating process has been developed as a solder supplying process for assembling TCP(Tape Carrier Package) on a printed wiring board(PWB).More than 10 um thick solder is deposited on copper pads of a PWB by this process.The effectiveness depositing large particles of solder to maintain gaps among particles was confirmed to cause continuously displacement reaction between copper substrate and tin-lead ions in the solution.TCP with leads of 0.25mm pitch and 576 pin counts was successfully assembled with no short circuits and a high junction reliability on solder plated pads of the PWB. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | TCP / Electroless plating / Solder plating / Assembly technology / Solder supplying process / Printed wiring board |
| Paper # | CPM93-75 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1993/10/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Electroless solder plating as a new solder supplying process for TCP assembly |
| Sub Title (in English) | |
| Keyword(1) | TCP |
| Keyword(2) | Electroless plating |
| Keyword(3) | Solder plating |
| Keyword(4) | Assembly technology |
| Keyword(5) | Solder supplying process |
| Keyword(6) | Printed wiring board |
| 1st Author's Name | Minoru Fujita |
| 1st Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation() |
| 2nd Author's Name | Yoshiyuki Morihiro |
| 2nd Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation |
| 3rd Author's Name | Toshifumi Kimura |
| 3rd Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation |
| 4th Author's Name | Kouhei Murakami |
| 4th Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation |
| 5th Author's Name | Shinji Badono |
| 5th Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation |
| Date | 1993/10/18 |
| Paper # | CPM93-75 |
| Volume (vol) | vol.93 |
| Number (no) | 275 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |