Presentation | 1993/10/18 Electroless solder plating as a new solder supplying process for TCP assembly Minoru Fujita, Yoshiyuki Morihiro, Toshifumi Kimura, Kouhei Murakami, Shinji Badono, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Electroless solder plating process has been developed as a solder supplying process for assembling TCP(Tape Carrier Package) on a printed wiring board(PWB).More than 10 um thick solder is deposited on copper pads of a PWB by this process.The effectiveness depositing large particles of solder to maintain gaps among particles was confirmed to cause continuously displacement reaction between copper substrate and tin-lead ions in the solution.TCP with leads of 0.25mm pitch and 576 pin counts was successfully assembled with no short circuits and a high junction reliability on solder plated pads of the PWB. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | TCP / Electroless plating / Solder plating / Assembly technology / Solder supplying process / Printed wiring board |
Paper # | CPM93-75 |
Date of Issue |
Conference Information | |
Committee | CPM |
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Conference Date | 1993/10/18(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Electroless solder plating as a new solder supplying process for TCP assembly |
Sub Title (in English) | |
Keyword(1) | TCP |
Keyword(2) | Electroless plating |
Keyword(3) | Solder plating |
Keyword(4) | Assembly technology |
Keyword(5) | Solder supplying process |
Keyword(6) | Printed wiring board |
1st Author's Name | Minoru Fujita |
1st Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation() |
2nd Author's Name | Yoshiyuki Morihiro |
2nd Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation |
3rd Author's Name | Toshifumi Kimura |
3rd Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation |
4th Author's Name | Kouhei Murakami |
4th Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation |
5th Author's Name | Shinji Badono |
5th Author's Affiliation | Manufacturing Development Laboratory,Mitsubishi Electric Corporation |
Date | 1993/10/18 |
Paper # | CPM93-75 |
Volume (vol) | vol.93 |
Number (no) | 275 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |