| Presentation | 1996/8/20 optical module with MU connector interface using self-alignment technique by solder-bump chip bonding Tsuyoshi Hayashi, Hideki Tsunetsugu, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We applied a self-alignment technique that uses solder-bump chip bonding to alignment between photonic devices and optical fibers in optical modules. To achieve this, a chip-carrier with a ferrule which had a single-mode fiber inside it was developed. By solder bump bonding a photodiode onto the chip-carrier, we achieved a compact and simple MU receptacle-type receiver module that requires no optical-axis adjustment. Coupling evaluation by ray tracing method implied that our new receptacle module structure would also be applicable to LED-or VCSEL-to-fiber coupling in transmitter modules. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | solder-bump / optical coupling / optical fiber / self-alignment / chip-carrier with a ferrule / MU receptacle |
| Paper # | EDM-96-32,CPM-96-55,OPE-96-54,LQE-96-56 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1996/8/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | optical module with MU connector interface using self-alignment technique by solder-bump chip bonding |
| Sub Title (in English) | |
| Keyword(1) | solder-bump |
| Keyword(2) | optical coupling |
| Keyword(3) | optical fiber |
| Keyword(4) | self-alignment |
| Keyword(5) | chip-carrier with a ferrule |
| Keyword(6) | MU receptacle |
| 1st Author's Name | Tsuyoshi Hayashi |
| 1st Author's Affiliation | NTT Opto-electronics Laboratories() |
| 2nd Author's Name | Hideki Tsunetsugu |
| 2nd Author's Affiliation | NTT Opto-electronics Laboratories |
| Date | 1996/8/20 |
| Paper # | EDM-96-32,CPM-96-55,OPE-96-54,LQE-96-56 |
| Volume (vol) | vol.96 |
| Number (no) | 218 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |