Presentation 1996/8/20
Alignment-free packaging for optical modules using AuSn solder bump self-aligned assembly
Jun'ichi SASAKI, Isao YONEDA, Masataka ITOH, Hiroshi HONMOU, Akihiro UDA, Toshitaka TORIKAI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Low-cost opto-electronics packaging technology has been developed. Opto-electronics device assembly by alignment-free optical coupling is gaining increasing attention because of the potential for producing low cost optical modules. This paper reports on high precision self-aligned assembly technology for laser diode (LD) array modules and photo diode (PD) array modules using AuSn solder bump flip-chip bonding.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Opto-electronics packaging / Flip-chip / Solder bump / Self-aligned assembly
Paper # EDM-96-30,CPM-96-53,OPE-96-52,LQE-96-54
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Conference Information
Committee CPM
Conference Date 1996/8/20(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Alignment-free packaging for optical modules using AuSn solder bump self-aligned assembly
Sub Title (in English)
Keyword(1) Opto-electronics packaging
Keyword(2) Flip-chip
Keyword(3) Solder bump
Keyword(4) Self-aligned assembly
1st Author's Name Jun'ichi SASAKI
1st Author's Affiliation Opto-electronics Res. Labs., NEC Corporation()
2nd Author's Name Isao YONEDA
2nd Author's Affiliation 2nd Transmission div., NEC Corporation
3rd Author's Name Masataka ITOH
3rd Author's Affiliation Opto-electronics Res. Labs., NEC Corporation
4th Author's Name Hiroshi HONMOU
4th Author's Affiliation 2nd Transmission div., NEC Corporation
5th Author's Name Akihiro UDA
5th Author's Affiliation Kansai Electronics Res. Lab., NEC Corporation
6th Author's Name Toshitaka TORIKAI
6th Author's Affiliation Kansai Electronics Res. Lab., NEC Corporation
Date 1996/8/20
Paper # EDM-96-30,CPM-96-53,OPE-96-52,LQE-96-54
Volume (vol) vol.96
Number (no) 218
Page pp.pp.-
#Pages 6
Date of Issue