Presentation | 1996/8/20 Alignment-free packaging for optical modules using AuSn solder bump self-aligned assembly Jun'ichi SASAKI, Isao YONEDA, Masataka ITOH, Hiroshi HONMOU, Akihiro UDA, Toshitaka TORIKAI, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Low-cost opto-electronics packaging technology has been developed. Opto-electronics device assembly by alignment-free optical coupling is gaining increasing attention because of the potential for producing low cost optical modules. This paper reports on high precision self-aligned assembly technology for laser diode (LD) array modules and photo diode (PD) array modules using AuSn solder bump flip-chip bonding. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Opto-electronics packaging / Flip-chip / Solder bump / Self-aligned assembly |
Paper # | EDM-96-30,CPM-96-53,OPE-96-52,LQE-96-54 |
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Conference Information | |
Committee | CPM |
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Conference Date | 1996/8/20(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Alignment-free packaging for optical modules using AuSn solder bump self-aligned assembly |
Sub Title (in English) | |
Keyword(1) | Opto-electronics packaging |
Keyword(2) | Flip-chip |
Keyword(3) | Solder bump |
Keyword(4) | Self-aligned assembly |
1st Author's Name | Jun'ichi SASAKI |
1st Author's Affiliation | Opto-electronics Res. Labs., NEC Corporation() |
2nd Author's Name | Isao YONEDA |
2nd Author's Affiliation | 2nd Transmission div., NEC Corporation |
3rd Author's Name | Masataka ITOH |
3rd Author's Affiliation | Opto-electronics Res. Labs., NEC Corporation |
4th Author's Name | Hiroshi HONMOU |
4th Author's Affiliation | 2nd Transmission div., NEC Corporation |
5th Author's Name | Akihiro UDA |
5th Author's Affiliation | Kansai Electronics Res. Lab., NEC Corporation |
6th Author's Name | Toshitaka TORIKAI |
6th Author's Affiliation | Kansai Electronics Res. Lab., NEC Corporation |
Date | 1996/8/20 |
Paper # | EDM-96-30,CPM-96-53,OPE-96-52,LQE-96-54 |
Volume (vol) | vol.96 |
Number (no) | 218 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |