| Presentation | 1996/8/20 Alignment-free packaging for optical modules using AuSn solder bump self-aligned assembly Jun'ichi SASAKI, Isao YONEDA, Masataka ITOH, Hiroshi HONMOU, Akihiro UDA, Toshitaka TORIKAI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Low-cost opto-electronics packaging technology has been developed. Opto-electronics device assembly by alignment-free optical coupling is gaining increasing attention because of the potential for producing low cost optical modules. This paper reports on high precision self-aligned assembly technology for laser diode (LD) array modules and photo diode (PD) array modules using AuSn solder bump flip-chip bonding. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Opto-electronics packaging / Flip-chip / Solder bump / Self-aligned assembly |
| Paper # | EDM-96-30,CPM-96-53,OPE-96-52,LQE-96-54 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 1996/8/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Alignment-free packaging for optical modules using AuSn solder bump self-aligned assembly |
| Sub Title (in English) | |
| Keyword(1) | Opto-electronics packaging |
| Keyword(2) | Flip-chip |
| Keyword(3) | Solder bump |
| Keyword(4) | Self-aligned assembly |
| 1st Author's Name | Jun'ichi SASAKI |
| 1st Author's Affiliation | Opto-electronics Res. Labs., NEC Corporation() |
| 2nd Author's Name | Isao YONEDA |
| 2nd Author's Affiliation | 2nd Transmission div., NEC Corporation |
| 3rd Author's Name | Masataka ITOH |
| 3rd Author's Affiliation | Opto-electronics Res. Labs., NEC Corporation |
| 4th Author's Name | Hiroshi HONMOU |
| 4th Author's Affiliation | 2nd Transmission div., NEC Corporation |
| 5th Author's Name | Akihiro UDA |
| 5th Author's Affiliation | Kansai Electronics Res. Lab., NEC Corporation |
| 6th Author's Name | Toshitaka TORIKAI |
| 6th Author's Affiliation | Kansai Electronics Res. Lab., NEC Corporation |
| Date | 1996/8/20 |
| Paper # | EDM-96-30,CPM-96-53,OPE-96-52,LQE-96-54 |
| Volume (vol) | vol.96 |
| Number (no) | 218 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |