Presentation | 1996/8/20 Adhesive Sealing Technologies for LD Module Using Si Platform Kazunori MIURA, Seimi SASAKI, Kazuhiro TANAKA, Mitsuhiro YANO, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | We developed an adhesive sealing technique for a LD module using Si platform and patterning method of the adhesive on a Si rid using screen printing technologies. LD modules of 20 samples were fabricated using the adhesive sealing technique and a passive alignment technique we previously proposed. We evaluated these samples and obtained stable optical coupling over the wide temperature range and good sealing characteristics. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Si Platform / LD module / Adhesive sealing / Screen printing |
Paper # | EDM-96-25,CPM-96-48,OPE-96-47,LQE-96-49 |
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Conference Information | |
Committee | CPM |
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Conference Date | 1996/8/20(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
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Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Adhesive Sealing Technologies for LD Module Using Si Platform |
Sub Title (in English) | |
Keyword(1) | Si Platform |
Keyword(2) | LD module |
Keyword(3) | Adhesive sealing |
Keyword(4) | Screen printing |
1st Author's Name | Kazunori MIURA |
1st Author's Affiliation | FUJITSU LABORATORIES LTD.() |
2nd Author's Name | Seimi SASAKI |
2nd Author's Affiliation | FUJITSU LABORATORIES LTD. |
3rd Author's Name | Kazuhiro TANAKA |
3rd Author's Affiliation | FUJITSU LABORATORIES LTD. |
4th Author's Name | Mitsuhiro YANO |
4th Author's Affiliation | FUJITSU LABORATORIES LTD. |
Date | 1996/8/20 |
Paper # | EDM-96-25,CPM-96-48,OPE-96-47,LQE-96-49 |
Volume (vol) | vol.96 |
Number (no) | 218 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |