Presentation 1996/8/20
Adhesive Sealing Technologies for LD Module Using Si Platform
Kazunori MIURA, Seimi SASAKI, Kazuhiro TANAKA, Mitsuhiro YANO,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We developed an adhesive sealing technique for a LD module using Si platform and patterning method of the adhesive on a Si rid using screen printing technologies. LD modules of 20 samples were fabricated using the adhesive sealing technique and a passive alignment technique we previously proposed. We evaluated these samples and obtained stable optical coupling over the wide temperature range and good sealing characteristics.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Si Platform / LD module / Adhesive sealing / Screen printing
Paper # EDM-96-25,CPM-96-48,OPE-96-47,LQE-96-49
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Conference Information
Committee CPM
Conference Date 1996/8/20(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Adhesive Sealing Technologies for LD Module Using Si Platform
Sub Title (in English)
Keyword(1) Si Platform
Keyword(2) LD module
Keyword(3) Adhesive sealing
Keyword(4) Screen printing
1st Author's Name Kazunori MIURA
1st Author's Affiliation FUJITSU LABORATORIES LTD.()
2nd Author's Name Seimi SASAKI
2nd Author's Affiliation FUJITSU LABORATORIES LTD.
3rd Author's Name Kazuhiro TANAKA
3rd Author's Affiliation FUJITSU LABORATORIES LTD.
4th Author's Name Mitsuhiro YANO
4th Author's Affiliation FUJITSU LABORATORIES LTD.
Date 1996/8/20
Paper # EDM-96-25,CPM-96-48,OPE-96-47,LQE-96-49
Volume (vol) vol.96
Number (no) 218
Page pp.pp.-
#Pages 6
Date of Issue