Presentation 1996/11/8
Sputter-Deposition of Co films Under Complete Thermalization Conditions
Kiyoshi ISHII, Masami KAWAZU, Hironori MINAMIDA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) By utilizing forced Ar gas flow through a hollow cathode target, effective sputter-deposition of films is allowable even at 1-Torr range. The sputtered particles are completely thermalized by collisions with Ar gas before depositing onto the substrate. It has been found that Co films having a fine columnar structure with distinct grain boundaries are obtained at considerably high rates by this peculiar process.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) sputtering method / sputtered Film / gas-flow-sputtering / Co film
Paper # CPM96-112
Date of Issue

Conference Information
Committee CPM
Conference Date 1996/11/8(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Sputter-Deposition of Co films Under Complete Thermalization Conditions
Sub Title (in English)
Keyword(1) sputtering method
Keyword(2) sputtered Film
Keyword(3) gas-flow-sputtering
Keyword(4) Co film
1st Author's Name Kiyoshi ISHII
1st Author's Affiliation Faculty of Engineering, Utsunomiya University()
2nd Author's Name Masami KAWAZU
2nd Author's Affiliation Faculty of Engineering, Utsunomiya University
3rd Author's Name Hironori MINAMIDA
3rd Author's Affiliation Faculty of Engineering, Utsunomiya University
Date 1996/11/8
Paper # CPM96-112
Volume (vol) vol.96
Number (no) 350
Page pp.pp.-
#Pages 6
Date of Issue