Presentation 1996/11/8
Barrier properties of W-nitride in the Cu/W-nitride/Si contact system
Mayumi TAKEYAMA, Atsushi NOYA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have prepared the WN_x thin films with various composition by reactive sputtering, and also investigated their characterizations and the thermal stability of the Cu/WN_x/Si contact system using the obtained WN_x films. The results indicate that the W_<65>N_<35> barrier consisting of W_2N phase with the (111) preferred orientation shows the excellent barrier properties for Cu metallization. The obtained Cu/W_<65>N_<35>/Si contact system is fairly stable up to the annealing temperature at 800℃ or above. This is probably because the excellent properties of the W_2N film, such as impurity free, good crystallinity, and scarce change in structure due to annealing, lead to the thermal stability of the contact system.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Cu metallization / preferential orientation / thermal stability / nitride / diffusion barrier
Paper # CPM96-107
Date of Issue

Conference Information
Committee CPM
Conference Date 1996/11/8(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Barrier properties of W-nitride in the Cu/W-nitride/Si contact system
Sub Title (in English)
Keyword(1) Cu metallization
Keyword(2) preferential orientation
Keyword(3) thermal stability
Keyword(4) nitride
Keyword(5) diffusion barrier
1st Author's Name Mayumi TAKEYAMA
1st Author's Affiliation Dept. of Electrical and Electronic Engineering, Kitami Institute of Technology()
2nd Author's Name Atsushi NOYA
2nd Author's Affiliation Dept. of Electrical and Electronic Engineering, Kitami Institute of Technology
Date 1996/11/8
Paper # CPM96-107
Volume (vol) vol.96
Number (no) 350
Page pp.pp.-
#Pages 8
Date of Issue