| Presentation | 1996/10/25 Development of Molding Using Resin Granules for IC Packages Kosuke Azuma, Hirosi Ise, Toshio Noda, Takanori Yamashita, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In these years, the requirement for the price reduction of semiconducter divices has been stronger, because of the price competition of electronics products markets. At molding process of IC assembly, it seems that resin granules can reduce molding cost due to high utilization of molding resin, lower resin cost and less controling cost of resin in the production line. However, there has been so many engineering items to put resin granules into actual mass production. This report shows the details of development process of mass production with resin granules. We have achieved the same molding quality using resin granules as resin tablet molding, with higher transfer speed, lower dieset temperature and evacuate molding system. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | resin mold package / resin granules / plunger / evacuate / mold / void |
| Paper # | CPM96-95 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1996/10/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of Molding Using Resin Granules for IC Packages |
| Sub Title (in English) | |
| Keyword(1) | resin mold package |
| Keyword(2) | resin granules |
| Keyword(3) | plunger |
| Keyword(4) | evacuate |
| Keyword(5) | mold |
| Keyword(6) | void |
| 1st Author's Name | Kosuke Azuma |
| 1st Author's Affiliation | VLSI Packaging Process Development Dept. VLSI Packaging and Testing Engineering Div. NEC Corporation() |
| 2nd Author's Name | Hirosi Ise |
| 2nd Author's Affiliation | VLSI Packaging Process Development Dept. VLSI Packaging and Testing Engineering Div. NEC Corporation |
| 3rd Author's Name | Toshio Noda |
| 3rd Author's Affiliation | VLSI Packaging Process Development Dept. VLSI Packaging and Testing Engineering Div. NEC Corporation |
| 4th Author's Name | Takanori Yamashita |
| 4th Author's Affiliation | VLSI Packaging Process Development Dept. VLSI Packaging and Testing Engineering Div. NEC Corporation |
| Date | 1996/10/25 |
| Paper # | CPM96-95 |
| Volume (vol) | vol.96 |
| Number (no) | 329 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |