Presentation	1997/3/14 Recent Trend of Reliability Stress Screening of Electronic Components Around IEC TC56 The second report TOKIO MUTO,
PDF Download Page	PDF download Page Link
Abstract(in Japanese)	(See Japanese page)
Abstract(in English)	The system as Internet or Mulimedia must be constracted by many reliable components. But even they are reliable, we are afraid of any latent weakness which can not remove prfectly and may cause any troubles in future. Reliability Stress Screening is the way of removing such latent weakness. So IEC TC56 has discussed to establish two specifications for in the field of Reliability Stress Screening, the one is for Electronic Components and the other for application guide: Electronic Hardware. The former is to be IEC 1163-2, and the latter IEC 300-3-7.
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)	Reliability Stress Screening / Induced Flaw / Inadeqated Design
Paper #	R96-45,CPM96-154
Date of Issue

Conference Information
Committee	CPM
Conference Date	1997/3/14(1days)
Place (in Japanese)	(See Japanese page)
Place (in English)
Topics (in Japanese)	(See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To	Component Parts and Materials (CPM)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	Recent Trend of Reliability Stress Screening of Electronic Components Around IEC TC56 The second report
Sub Title (in English)
Keyword(1)	Reliability Stress Screening
Keyword(2)	Induced Flaw
Keyword(3)	Inadeqated Design
1st Author's Name	TOKIO MUTO
1st Author's Affiliation	Society for Hybrid Microelectronics()
Date	1997/3/14
Paper #	R96-45,CPM96-154
Volume (vol)	vol.96
Number (no)	575
Page	pp.pp.-
#Pages	6
Date of Issue