| Presentation | 1997/12/12 Mechanical and Chemical Characteristics of Package Interface in Chip Scale Packages Masazumi Amagai, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Chip scale package (CSP) has been developed for center pad memory devices. The CSP is classified into two designs, tapeless lead on chip (LOC) and flexible substrate, respectively. The CSP with a LOC design consists of a polyimide-deposited chip which is bonded to a lead frame and then encapsulated with a molding compound. The CSP made with flexible a substrate consists of a polyimide-deposited chip which is boned to the flexible substrate with a thermoplastic polyimide and subsequently encapsulated with a liquid epoxy compound. Wire bonding technology was used for both of CSPs. A 52 ball package is composed of solder balls (0.6 mm in diameter on a 1.00 mm pitch) which are attached to either the lead frame or the flexible substrate. This paper focused on mechanical and chemical characteristics of package interface and solder joint reliability. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | CSP / Center Pad Bonding / Solder Ball / LOC / Flexible Substrate |
| Paper # | CPM97-157 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1997/12/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Mechanical and Chemical Characteristics of Package Interface in Chip Scale Packages |
| Sub Title (in English) | |
| Keyword(1) | CSP |
| Keyword(2) | Center Pad Bonding |
| Keyword(3) | Solder Ball |
| Keyword(4) | LOC |
| Keyword(5) | Flexible Substrate |
| 1st Author's Name | Masazumi Amagai |
| 1st Author's Affiliation | Package Development Dept., Texas Instruments Japan() |
| Date | 1997/12/12 |
| Paper # | CPM97-157 |
| Volume (vol) | vol.97 |
| Number (no) | 434 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |