Presentation 1997/12/12
Mechanical and Chemical Characteristics of Package Interface in Chip Scale Packages
Masazumi Amagai,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Chip scale package (CSP) has been developed for center pad memory devices. The CSP is classified into two designs, tapeless lead on chip (LOC) and flexible substrate, respectively. The CSP with a LOC design consists of a polyimide-deposited chip which is bonded to a lead frame and then encapsulated with a molding compound. The CSP made with flexible a substrate consists of a polyimide-deposited chip which is boned to the flexible substrate with a thermoplastic polyimide and subsequently encapsulated with a liquid epoxy compound. Wire bonding technology was used for both of CSPs. A 52 ball package is composed of solder balls (0.6 mm in diameter on a 1.00 mm pitch) which are attached to either the lead frame or the flexible substrate. This paper focused on mechanical and chemical characteristics of package interface and solder joint reliability.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) CSP / Center Pad Bonding / Solder Ball / LOC / Flexible Substrate
Paper # CPM97-157
Date of Issue

Conference Information
Committee CPM
Conference Date 1997/12/12(1days)
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Place (in English)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Mechanical and Chemical Characteristics of Package Interface in Chip Scale Packages
Sub Title (in English)
Keyword(1) CSP
Keyword(2) Center Pad Bonding
Keyword(3) Solder Ball
Keyword(4) LOC
Keyword(5) Flexible Substrate
1st Author's Name Masazumi Amagai
1st Author's Affiliation Package Development Dept., Texas Instruments Japan()
Date 1997/12/12
Paper # CPM97-157
Volume (vol) vol.97
Number (no) 434
Page pp.pp.-
#Pages 5
Date of Issue