Presentation 1997/12/12
High Density BGA Substrate by Laser Technologies
Tadashi Hirakawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Several kinds of BGA substrates were developed using laser technologies. A high energy CO2 laser was applied on either polyimide film or aramid-based laminate. A single-metallized polyimide film was processed to have openings for ball pads, and the traces were extended directly form the chip. Thus, BGA (or CSP) substrates were obtained, having the highest density and highest relisbility with JEDEC Level 2 or more. Bonding shelves with multiple structures, independent trace structures, and stair-structure flip-chip substrates were also developed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) laser / BGA / CSR / polyamide / aramid / bonding / flip-chip
Paper # CPM97-156
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Conference Information
Committee CPM
Conference Date 1997/12/12(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High Density BGA Substrate by Laser Technologies
Sub Title (in English)
Keyword(1) laser
Keyword(2) BGA
Keyword(3) CSR
Keyword(4) polyamide
Keyword(5) aramid
Keyword(6) bonding
Keyword(7) flip-chip
1st Author's Name Tadashi Hirakawa
1st Author's Affiliation Fuji Machinery Mfg. & Electronics Co., Ltd.()
Date 1997/12/12
Paper # CPM97-156
Volume (vol) vol.97
Number (no) 434
Page pp.pp.-
#Pages 5
Date of Issue