| Presentation | 1997/12/12 High Density BGA Substrate by Laser Technologies Tadashi Hirakawa, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Several kinds of BGA substrates were developed using laser technologies. A high energy CO2 laser was applied on either polyimide film or aramid-based laminate. A single-metallized polyimide film was processed to have openings for ball pads, and the traces were extended directly form the chip. Thus, BGA (or CSP) substrates were obtained, having the highest density and highest relisbility with JEDEC Level 2 or more. Bonding shelves with multiple structures, independent trace structures, and stair-structure flip-chip substrates were also developed. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | laser / BGA / CSR / polyamide / aramid / bonding / flip-chip |
| Paper # | CPM97-156 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 1997/12/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | High Density BGA Substrate by Laser Technologies |
| Sub Title (in English) | |
| Keyword(1) | laser |
| Keyword(2) | BGA |
| Keyword(3) | CSR |
| Keyword(4) | polyamide |
| Keyword(5) | aramid |
| Keyword(6) | bonding |
| Keyword(7) | flip-chip |
| 1st Author's Name | Tadashi Hirakawa |
| 1st Author's Affiliation | Fuji Machinery Mfg. & Electronics Co., Ltd.() |
| Date | 1997/12/12 |
| Paper # | CPM97-156 |
| Volume (vol) | vol.97 |
| Number (no) | 434 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |