Presentation 1997/12/12
Efficiency of plasma cleaning on BGA/CSP manufacturing process : Application technology of plasma cleaning to make gold plating film thinner
Kazuhiro Noda,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) The effects of plasma cleaning for BGA(Ball Grid Array) /CSP(Chip Scale Package) packages production were investigated. The results obtained are as follows. (1)The plasma cleaning equipment can remove NiOH on the cured surface of substitution plating BGA/CSP. (2)The nickel concentration at the gold film surface decreased with plasma cleaning, and as a result the bond shear strength increased. (3)The solder joint shear strength after the heat treatment depended on gold film thickness.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) BGA / CSP / Plasma cleaning / Gold plating / Solder ball / Nickel
Paper # CPM97-155
Date of Issue

Conference Information
Committee CPM
Conference Date 1997/12/12(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Efficiency of plasma cleaning on BGA/CSP manufacturing process : Application technology of plasma cleaning to make gold plating film thinner
Sub Title (in English)
Keyword(1) BGA
Keyword(2) CSP
Keyword(3) Plasma cleaning
Keyword(4) Gold plating
Keyword(5) Solder ball
Keyword(6) Nickel
1st Author's Name Kazuhiro Noda
1st Author's Affiliation Kyushu Mastusita Electric co. ltd.()
Date 1997/12/12
Paper # CPM97-155
Volume (vol) vol.97
Number (no) 434
Page pp.pp.-
#Pages 5
Date of Issue