| Presentation | 1997/12/12 Recent trends and future targets in electronic packaging for high-performance computers Tatsuo Inoue, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The electronic packaging plays more valuable roles than ever according to the operating frequency becomes higher in high-performance computers. This report describes recent trends and future targets in electronic packaging for high-performance computers with analyzing it's circumstances. First of all, the type of LSIs which construct processors has changed from Bipolar to CMOS. Then the simple packaging structure becomes in common which using single source of micro processor to realize CPU ranging from PC to the high-end server. This structure enables scalable high-performance computing accompanied with the progress of the programming for the parallel computing. On the contrary, the large processors such as vector processors have not yet been constructed into single LSIs, we should develop the novel technologies such as multi-chip packaging, which realizes higher frequency operations. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | electronic packaging / super computer / high-performance computing / LSI / MCM / parallel computing |
| Paper # | CPM97-154 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1997/12/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Recent trends and future targets in electronic packaging for high-performance computers |
| Sub Title (in English) | |
| Keyword(1) | electronic packaging |
| Keyword(2) | super computer |
| Keyword(3) | high-performance computing |
| Keyword(4) | LSI |
| Keyword(5) | MCM |
| Keyword(6) | parallel computing |
| 1st Author's Name | Tatsuo Inoue |
| 1st Author's Affiliation | Circuit Packaging Engineering Department, NEC corporation, Computers Division() |
| Date | 1997/12/12 |
| Paper # | CPM97-154 |
| Volume (vol) | vol.97 |
| Number (no) | 434 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |