| Presentation | 1997/12/12 Packaging Technology for a Surface Mount type Optical Transceiver A. Kawatani, H. Fujimi, K. Shuke, T. Yoshida, K. Kurata, R. Nagaoka, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Achievement of a low cost and small size optical transmitter/receiver is a vital factor in realizing economical subscriber network and trunk line network. To meet such requirement, low cost packaging technology for a surface mount type optical transmitter/receiver is newly developed under the idea of surface mounting and reflow soldering. High productivity and compact size is achieved in this modules by using the hybrid packaging of the optical passive alignment techniques and bare IC mounting technology. The compact optical coupling unit on the Si substrate enabled us to use a surface mount type package. The size of this transmitter/receiver is 10.2×26×3mm each. And a high thermal conductivity package structure can operate it over -40 to +85 degree Celsius ambient temperature. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Optical transmitter/receiver / Passive alignment / Bare chip mounting / Surface mount |
| Paper # | CPM97-153 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1997/12/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Packaging Technology for a Surface Mount type Optical Transceiver |
| Sub Title (in English) | |
| Keyword(1) | Optical transmitter/receiver |
| Keyword(2) | Passive alignment |
| Keyword(3) | Bare chip mounting |
| Keyword(4) | Surface mount |
| 1st Author's Name | A. Kawatani |
| 1st Author's Affiliation | Transmission Devices Div. NEC Corporation() |
| 2nd Author's Name | H. Fujimi |
| 2nd Author's Affiliation | NEC Engineering, Ltd. |
| 3rd Author's Name | K. Shuke |
| 3rd Author's Affiliation | Transmission Devices Div. NEC Corporation |
| 4th Author's Name | T. Yoshida |
| 4th Author's Affiliation | Transmission Devices Div. NEC Corporation |
| 5th Author's Name | K. Kurata |
| 5th Author's Affiliation | Transmission Devices Div. NEC Corporation |
| 6th Author's Name | R. Nagaoka |
| 6th Author's Affiliation | Transmission Devices Div. NEC Corporation |
| Date | 1997/12/12 |
| Paper # | CPM97-153 |
| Volume (vol) | vol.97 |
| Number (no) | 434 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |