Presentation | 1997/8/22 High speed hybrid integrated transmitter module using a planar lightwave circuit platform Takaharu Ohyama, Yuji Akahori, Masahiro Yanagisawa, Hideki Tsunetsugu, Sinji Mino, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | A high speed optoelectronic hybrid integrated transmitter module using a novel silica-based planar lightwave circuit (PLC) platform has been developed. This module consists of a laser diode (LD) array and a LD driver integrated circuit (IC) flip-chip bonded on the PLC platform. The high speed operation was realized employing coplanar waveguides and microstrip lines for the electrical signal transmission lines and two-layer wiring for the power lines that offer electrically stable ground plane. The optical and electrical devices are successfully flip-chip bonded on the same PLC platform by two step bonding process that employed different solder materials. A back-to-back bit-error-rate measurements showed an error-free operation at 9 Gbit/s NRZ signal. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | PLC platform / hybrid integration / solder bump / flip-chip bonding / coplanar waveguide / microstrip line |
Paper # | CPM97-90 |
Date of Issue |
Conference Information | |
Committee | CPM |
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Conference Date | 1997/8/22(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | High speed hybrid integrated transmitter module using a planar lightwave circuit platform |
Sub Title (in English) | |
Keyword(1) | PLC platform |
Keyword(2) | hybrid integration |
Keyword(3) | solder bump |
Keyword(4) | flip-chip bonding |
Keyword(5) | coplanar waveguide |
Keyword(6) | microstrip line |
1st Author's Name | Takaharu Ohyama |
1st Author's Affiliation | NTT Opto-electronics Laboratories() |
2nd Author's Name | Yuji Akahori |
2nd Author's Affiliation | NTT Opto-electronics Laboratories |
3rd Author's Name | Masahiro Yanagisawa |
3rd Author's Affiliation | NTT Opto-electronics Laboratories |
4th Author's Name | Hideki Tsunetsugu |
4th Author's Affiliation | NTT Opto-electronics Laboratories |
5th Author's Name | Sinji Mino |
5th Author's Affiliation | NTT Optical Network Systems Laboratories |
Date | 1997/8/22 |
Paper # | CPM97-90 |
Volume (vol) | vol.97 |
Number (no) | 234 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |