Presentation 1997/8/21
Integrated optical isolator employing wafer direct bonding technique
Hideki YOKOI, Tetsuya MIZUMOTO,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Magnetic garnets, which are magnetooptic materials and almost transparent in the near infrared region, are utilized to compose optical nonreciprocal devices. Wafer direct bonding between InP and garnets has been investigated for the aim of integrating a semiconductor laser diode with an optical isolator. Some experimental results of the direct bonding between InP and garnets are described. A new configuration of integrated optical isolator which makes full use of the direct bonding technique is also proposed.
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Keyword(in English) optical isolator / direct bonding / semiconductor laser diode / garnet
Paper # CPM97-71
Date of Issue

Conference Information
Committee CPM
Conference Date 1997/8/21(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Integrated optical isolator employing wafer direct bonding technique
Sub Title (in English)
Keyword(1) optical isolator
Keyword(2) direct bonding
Keyword(3) semiconductor laser diode
Keyword(4) garnet
1st Author's Name Hideki YOKOI
1st Author's Affiliation Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology()
2nd Author's Name Tetsuya MIZUMOTO
2nd Author's Affiliation Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology
Date 1997/8/21
Paper # CPM97-71
Volume (vol) vol.97
Number (no) 233
Page pp.pp.-
#Pages 6
Date of Issue