Presentation | 1997/8/21 Integrated optical isolator employing wafer direct bonding technique Hideki YOKOI, Tetsuya MIZUMOTO, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Magnetic garnets, which are magnetooptic materials and almost transparent in the near infrared region, are utilized to compose optical nonreciprocal devices. Wafer direct bonding between InP and garnets has been investigated for the aim of integrating a semiconductor laser diode with an optical isolator. Some experimental results of the direct bonding between InP and garnets are described. A new configuration of integrated optical isolator which makes full use of the direct bonding technique is also proposed. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | optical isolator / direct bonding / semiconductor laser diode / garnet |
Paper # | CPM97-71 |
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Conference Information | |
Committee | CPM |
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Conference Date | 1997/8/21(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Integrated optical isolator employing wafer direct bonding technique |
Sub Title (in English) | |
Keyword(1) | optical isolator |
Keyword(2) | direct bonding |
Keyword(3) | semiconductor laser diode |
Keyword(4) | garnet |
1st Author's Name | Hideki YOKOI |
1st Author's Affiliation | Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology() |
2nd Author's Name | Tetsuya MIZUMOTO |
2nd Author's Affiliation | Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology |
Date | 1997/8/21 |
Paper # | CPM97-71 |
Volume (vol) | vol.97 |
Number (no) | 233 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |