Presentation 2002/1/4
Throughput Comparison Between Multipath Interference Canceller and Chip Equalizer in HSDPA
Teruo KAWAMURA, Yoshihisa KISHIYAMA, Kenichi HIGUCHI, Mamoru SAWAHASHI,
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Abstract(in English) This paper compares the throughput performance of a multipath interference canceller (MPIC) and a chip equalizer in high speed downlink packet access (HSDPA) based on computer simulations, in order to inerease the achievable throughput. The simulation results from an isolated-cell model elucidate that the required average received E_b/N_0 employing the MPIC with QPSK data modulation is decreased by approximaely 0.5 dB compared to that with the chip cqualizer in a lower received E_b/N_0 channel such as at the average throughput of 3 Mbps. Furthermore, we clarify that the chip equalizer is superior to the MPIC in a higher received E_b/N_0 channel where 16QAM or 64QAM modulationt is used in an adaptive modulation scheme.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) High speed downlink packet access / Interference canceller / Chip equalizer / Multipath interference
Paper # 2001-DSP-179,2001-SAT-137,2001-RCS-237
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Committee SAT
Conference Date 2002/1/4(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Throughput Comparison Between Multipath Interference Canceller and Chip Equalizer in HSDPA
Sub Title (in English)
Keyword(1) High speed downlink packet access
Keyword(2) Interference canceller
Keyword(3) Chip equalizer
Keyword(4) Multipath interference
1st Author's Name Teruo KAWAMURA
1st Author's Affiliation Wireless Laboratories, NTT DoCoMo, Inc.()
2nd Author's Name Yoshihisa KISHIYAMA
2nd Author's Affiliation Wireless Laboratories, NTT DoCoMo, Inc.
3rd Author's Name Kenichi HIGUCHI
3rd Author's Affiliation Wireless Laboratories, NTT DoCoMo, Inc.
4th Author's Name Mamoru SAWAHASHI
4th Author's Affiliation Wireless Laboratories, NTT DoCoMo, Inc.
Date 2002/1/4
Paper # 2001-DSP-179,2001-SAT-137,2001-RCS-237
Volume (vol) vol.101
Number (no) 542
Page pp.pp.-
#Pages 8
Date of Issue