Presentation | 2000/7/14 Reduction of Electromagnetic radiation by placing capacitors between adjacent power planes for printed circuit board Ayako TAKAGI, Haruhiko OKUMURA, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Reduction of electromagnetic radiation technique for Printed circuit board whose power plane is divided by some voltage power sources in the same layer is reported. By placing capacitors between adjacent power planes, high frequency current is distributed another power plane and high frequency voltage is suppressed at both ends of power planes. Electromagnetic radiation reduces by 10dB at the result of test circuit board measurement. At first capacitors must be placed at both ends of adjacent side each other to suppress another extra resonance by linear circuit simulation. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | EMI / capacitors / resonance frequency / noise / S-parameter / printed circuit board |
Paper # | EMCJ2000-36 |
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Committee | EMCJ |
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Conference Date | 2000/7/14(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Electromagnetic Compatibility (EMCJ) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Reduction of Electromagnetic radiation by placing capacitors between adjacent power planes for printed circuit board |
Sub Title (in English) | |
Keyword(1) | EMI |
Keyword(2) | capacitors |
Keyword(3) | resonance frequency |
Keyword(4) | noise |
Keyword(5) | S-parameter |
Keyword(6) | printed circuit board |
1st Author's Name | Ayako TAKAGI |
1st Author's Affiliation | Corporate Research and Development Center, Toshiba Corporation() |
2nd Author's Name | Haruhiko OKUMURA |
2nd Author's Affiliation | Corporate Research and Development Center, Toshiba Corporation |
Date | 2000/7/14 |
Paper # | EMCJ2000-36 |
Volume (vol) | vol.100 |
Number (no) | 207 |
Page | pp.pp.- |
#Pages | 7 |
Date of Issue |