Presentation 2000/7/14
Impedance Analysis on Power Distribution Lines in Multi-layer Printed Wiring Board
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) To research the relationship between a board resonance and an effect of an additional inductance to the power lines in a module on PWB, we constructed a real-board and made measurements of its radiated emissions. In addition, impedance for elements of the board was measured and is related to its emissions. As a conclusion, for a board with a power-plane structure, the method of an additional inductance is much influenced by the effect of a loop resonance which includes a path through a decoupling capacitor. Each impedance of elements in a board can be a characteristic to evaluate the effect of an additional inductance.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) EMI / Inductance / Impedance / Printed Writing Board / Decoupling / Resonance
Paper # EMCJ2000-33
Date of Issue

Conference Information
Committee EMCJ
Conference Date 2000/7/14(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
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Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Impedance Analysis on Power Distribution Lines in Multi-layer Printed Wiring Board
Sub Title (in English)
Keyword(1) EMI
Keyword(2) Inductance
Keyword(3) Impedance
Keyword(4) Printed Writing Board
Keyword(5) Decoupling
Keyword(6) Resonance
1st Author's Name
1st Author's Affiliation EMC Engineering, Yamato Laboratory IBM Japan Ltd.()
Date 2000/7/14
Paper # EMCJ2000-33
Volume (vol) vol.100
Number (no) 207
Page pp.pp.-
#Pages 6
Date of Issue