Presentation 1995/10/20
Transient Analysis of High-Speed Signal Transmission Line via Hybrid Model Composed of Distributed and Lamped Elements
Satoshi ICHIKAWA, Eiji OKAMOTO, Koushi OKUMURA,
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Abstract(in English) Recently, the study of signal propagation phenomena of interconnection lines is very important for high-speed VLSI circuits and delay of sinnals, crosstalk and reflection phenomena can no longer be neglected. Most VLSI circuits are terminated with semiconductor devices and nonlinear effects of terminated elements and dispersive properties of transmission line should be taken into account. In this paper, we present one method to calculate transient analysis of hybrid model composed of interconnects of dispersive distributed lines and linear and nonlinear lamped elements. For distributed lines, we use augmented resistors and obtain step response by numerical inversion method of Laplace transform. Transient phenomena of total system are calculated in time domain by convolution integrals.
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Keyword(in English) hybrid model of distributed and lamped elements / convolution integral / augmented resistor / high-speed signal transmission line
Paper # EMCJ95-41,MW95-85
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Committee EMCJ
Conference Date 1995/10/20(1days)
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Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Transient Analysis of High-Speed Signal Transmission Line via Hybrid Model Composed of Distributed and Lamped Elements
Sub Title (in English)
Keyword(1) hybrid model of distributed and lamped elements
Keyword(2) convolution integral
Keyword(3) augmented resistor
Keyword(4) high-speed signal transmission line
1st Author's Name Satoshi ICHIKAWA
1st Author's Affiliation Graduate School of Engineering, Kyoto University()
2nd Author's Name Eiji OKAMOTO
2nd Author's Affiliation Communications Reserch Laboratory of MPT
3rd Author's Name Koushi OKUMURA
3rd Author's Affiliation Graduate School of Engineering, Kyoto University
Date 1995/10/20
Paper # EMCJ95-41,MW95-85
Volume (vol) vol.95
Number (no) 324
Page pp.pp.-
#Pages 8
Date of Issue