| Presentation | 1995/7/20 Inductances of IC Package and Printed Wiring Related to EMI of Digital Circuits Osami Wada, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Package inductance of semiconductor devices and wiring inductance affect the switching and EMI characteristics of high-speed digital circuits. The inductance, L, causes ground bounce, and also switching delay. Therefore it is important to decrease L for stable operation. Moreover the lower inductance makes the Q of resonance in digital circuit, which lowers the peak height of EMI spectrum. It is illustrated from the point of view of electromagnetism and electronic circuit theory that to decrease the inductance one should pay attention not only to the self inductance L but to the effective inductance L_ |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | digital circuit / EMI / package inductance / mutual inductance / ground bounce |
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| Conference Information | |
| Committee | EMCJ |
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| Conference Date | 1995/7/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Electromagnetic Compatibility (EMCJ) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Inductances of IC Package and Printed Wiring Related to EMI of Digital Circuits |
| Sub Title (in English) | |
| Keyword(1) | digital circuit |
| Keyword(2) | EMI |
| Keyword(3) | package inductance |
| Keyword(4) | mutual inductance |
| Keyword(5) | ground bounce |
| 1st Author's Name | Osami Wada |
| 1st Author's Affiliation | Faculty of Engineering, Okayama University() |
| Date | 1995/7/20 |
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| Volume (vol) | vol.95 |
| Number (no) | 154 |
| Page | pp.pp.- |
| #Pages | 6 |
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