Presentation 1997/11/26
Radiated emission from PCB with microstrip conductor offset
Keisuke OGAWA, Yasuhiro KIDO, Hiroaki KOGURE, Hideki NAKANO, Kohji KOSHIJI, Eimei SHU,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) As the performance speed is up in high density electronic circuit, radiated emission from electronic equipment has very serious problem. It is useful to compute the electromagnetic field distribution and the radiated emission using the TLM method that can deal with the three dimensional model such as a multilayered printed circuit or highly integrated cirucuit. It is inevitable that the microstrip lines formed on a PCB have microstrip conductor offset. This paper presents the analyses of the far field pattern and power radiated from the PCB with the microstrip conductor offset.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) microstrip line / offset / far field radiation pattern / TLM method
Paper # EMCJ97-77
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Conference Information
Committee EMCJ
Conference Date 1997/11/26(1days)
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Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Radiated emission from PCB with microstrip conductor offset
Sub Title (in English)
Keyword(1) microstrip line
Keyword(2) offset
Keyword(3) far field radiation pattern
Keyword(4) TLM method
1st Author's Name Keisuke OGAWA
1st Author's Affiliation Faculty of science and technology, Science University of Tokyo()
2nd Author's Name Yasuhiro KIDO
2nd Author's Affiliation Faculty of science and technology, Science University of Tokyo
3rd Author's Name Hiroaki KOGURE
3rd Author's Affiliation Faculty of science and technology, Science University of Tokyo
4th Author's Name Hideki NAKANO
4th Author's Affiliation Faculty of science and technology, Science University of Tokyo
5th Author's Name Kohji KOSHIJI
5th Author's Affiliation Faculty of science and technology, Science University of Tokyo
6th Author's Name Eimei SHU
6th Author's Affiliation Faculty of science and technology, Science University of Tokyo
Date 1997/11/26
Paper # EMCJ97-77
Volume (vol) vol.97
Number (no) 400
Page pp.pp.-
#Pages 7
Date of Issue