Presentation 1997/7/17
Efficient Characterization of Microstrip Interconnects with Arbitrary Loading and Excitation
Mahmoud OMID, Yoshio KAMI, Michitane CHIBA, Masashi HAYAKAWA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The electric field integral equation (EFIE) in space-domain based on a dyadic Green's function for a layered medium is exploited to determine the electric current distribution on arbitrarily oriented traces printed on the top surface of the microstrip circuit or PCB. The goal is to develop a hybrid numerical technique for an efficient characterization of interconnections fed by arbitrarily located current or voltage source and terminated by complex loads. The surface currents along the interconnect are obtained by the MoM and what remained (excitation and loading) are modeled through transmission line theory.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) PCB interconnections / source modeling / Sommerfeld integrals / Galerkin's MoM
Paper # EMCJ97-27
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Conference Information
Committee EMCJ
Conference Date 1997/7/17(1days)
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Registration To Electromagnetic Compatibility (EMCJ)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Efficient Characterization of Microstrip Interconnects with Arbitrary Loading and Excitation
Sub Title (in English)
Keyword(1) PCB interconnections
Keyword(2) source modeling
Keyword(3) Sommerfeld integrals
Keyword(4) Galerkin's MoM
1st Author's Name Mahmoud OMID
1st Author's Affiliation The University of Electro-Communications()
2nd Author's Name Yoshio KAMI
2nd Author's Affiliation The University of Electro-Communications
3rd Author's Name Michitane CHIBA
3rd Author's Affiliation The University of Electro-Communications
4th Author's Name Masashi HAYAKAWA
4th Author's Affiliation The University of Electro-Communications
Date 1997/7/17
Paper # EMCJ97-27
Volume (vol) vol.97
Number (no) 172
Page pp.pp.-
#Pages 9
Date of Issue