Presentation 2000/10/13
Failure Analysis of Electronic Components Using X-ray CT Scanner
Yoshiyuki Ihara, Kyouiti Tokunaga,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Presently, surface mounting methods are used for most electronic equipment and the majority of electronic components and material are surfce mounted types. Advances in the miniaturization of hese components and packages has for exceeded expectations. The writer and others clearly demonstrated the effectiveness of using an X-ray CT scanner, a non-destructive anaalyze components using this equipment, to make an failure analysis of electronic components. Since then, they have continued to analyze components using this equipment and have studied its effectiveness as non-destructive analysis methods. This report especially presents new approach of reliability test by the combination of life test and X-ray CT scanner failure analysis performance by the three-dimentionnal obsevbation of defect parts.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Failure Analysis / X-ray CT / Surface Mount Device / Chip Size Package / Solder Joint
Paper # R2000-21
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Conference Information
Committee R
Conference Date 2000/10/13(1days)
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Paper Information
Registration To Reliability(R)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Failure Analysis of Electronic Components Using X-ray CT Scanner
Sub Title (in English)
Keyword(1) Failure Analysis
Keyword(2) X-ray CT
Keyword(3) Surface Mount Device
Keyword(4) Chip Size Package
Keyword(5) Solder Joint
1st Author's Name Yoshiyuki Ihara
1st Author's Affiliation NEC Corporation()
2nd Author's Name Kyouiti Tokunaga
2nd Author's Affiliation Quality Management Promotion Division, NEC Corporation
Date 2000/10/13
Paper # R2000-21
Volume (vol) vol.100
Number (no) 377
Page pp.pp.-
#Pages 6
Date of Issue