Presentation 2000/9/15
Thermal design methodology to maintain reliability of electronic equipment
Takashi Kobayashi,
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Abstract(in English) This paper is to introduce thermal design approaches for high-density electronic packaging system. The performance enhancement and the size reduction of the enclosure causes the increase of power density. These considerations make the thermal design difficult for equipment designers, and create the needs for new thermal design solutions without compromising the enclosure's size, weight and total cost, etc.So, we are trying to develop two innovative thermal design methodologies for electronic equipment. The first solution is a knowledge driven thermal design methodology for electronic equipment by using expert knowledge and high performance cooling devices. As the second solution, a simulation based design review method with a digital mock-up which can optimize the cooling structure in a short time has already reached the stage for practical use.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Thermal design / Electronic equipment / Reliability / Knowledge based design technology
Paper # R2000-13
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Committee R
Conference Date 2000/9/15(1days)
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Registration To Reliability(R)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Thermal design methodology to maintain reliability of electronic equipment
Sub Title (in English)
Keyword(1) Thermal design
Keyword(2) Electronic equipment
Keyword(3) Reliability
Keyword(4) Knowledge based design technology
1st Author's Name Takashi Kobayashi
1st Author's Affiliation Design Systems Engineering Center Mitsubishi Electric Corporation()
Date 2000/9/15
Paper # R2000-13
Volume (vol) vol.100
Number (no) 313
Page pp.pp.-
#Pages 7
Date of Issue