Presentation 2000/2/18
An investigation of copper creeping phenomenon on electrical contacts
Tetsuo Hayase, Shigeaki Suzuki, Osamu Hayashi,
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Abstract(in English) We investigated the influence of gases emitted from LCP (Liquid Crystalline Polymer) that was used as for SMD relay's molding material. It was found that acetic acid degassed from LCP functioned a accelerating factor of copper creeping phenomenon on electrical contacts under high temperature condition. And we could show the fact that the very thin layer of copper compund caused by copper creeping increased contact resistance.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) electrical contacts / copper / creep / acetic acid / SMDrelay / LCP
Paper # R99-35,EMD99-85
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Conference Date 2000/2/18(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
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Title (in English) An investigation of copper creeping phenomenon on electrical contacts
Sub Title (in English)
Keyword(1) electrical contacts
Keyword(2) copper
Keyword(3) creep
Keyword(4) acetic acid
Keyword(5) SMDrelay
Keyword(6) LCP
1st Author's Name Tetsuo Hayase
1st Author's Affiliation OMRON Corporation:ELECTRONICS COMPONENTS COMPANY()
2nd Author's Name Shigeaki Suzuki
2nd Author's Affiliation OMRON Corporation:ELECTRONICS COMPONENTS COMPANY
3rd Author's Name Osamu Hayashi
3rd Author's Affiliation OMRON Corporation:ELECTRONICS COMPONENTS COMPANY
Date 2000/2/18
Paper # R99-35,EMD99-85
Volume (vol) vol.99
Number (no) 643
Page pp.pp.-
#Pages 5
Date of Issue