Presentation | 2000/2/18 An investigation of copper creeping phenomenon on electrical contacts Tetsuo Hayase, Shigeaki Suzuki, Osamu Hayashi, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | We investigated the influence of gases emitted from LCP (Liquid Crystalline Polymer) that was used as for SMD relay's molding material. It was found that acetic acid degassed from LCP functioned a accelerating factor of copper creeping phenomenon on electrical contacts under high temperature condition. And we could show the fact that the very thin layer of copper compund caused by copper creeping increased contact resistance. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | electrical contacts / copper / creep / acetic acid / SMDrelay / LCP |
Paper # | R99-35,EMD99-85 |
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Conference Information | |
Committee | R |
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Conference Date | 2000/2/18(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Assistant |
Paper Information | |
Registration To | Reliability(R) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | An investigation of copper creeping phenomenon on electrical contacts |
Sub Title (in English) | |
Keyword(1) | electrical contacts |
Keyword(2) | copper |
Keyword(3) | creep |
Keyword(4) | acetic acid |
Keyword(5) | SMDrelay |
Keyword(6) | LCP |
1st Author's Name | Tetsuo Hayase |
1st Author's Affiliation | OMRON Corporation:ELECTRONICS COMPONENTS COMPANY() |
2nd Author's Name | Shigeaki Suzuki |
2nd Author's Affiliation | OMRON Corporation:ELECTRONICS COMPONENTS COMPANY |
3rd Author's Name | Osamu Hayashi |
3rd Author's Affiliation | OMRON Corporation:ELECTRONICS COMPONENTS COMPANY |
Date | 2000/2/18 |
Paper # | R99-35,EMD99-85 |
Volume (vol) | vol.99 |
Number (no) | 643 |
Page | pp.pp.- |
#Pages | 5 |
Date of Issue |