| Presentation | 1999/2/19 Development of a low-profile heat pipe module as cooing technology Kouichi Fukumiya, Shinya Hamagishi, Seiji Karashima, Hiroshi Kuwaki, Norio Nakazato, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The authors developed a low-profile heat pipe module as one of the cooling technologies for high heat output LSIs. This cooling module consists of a parallel flat-plate fin, heat pipe, and plate fin. Its components are less than 7 mm high. To verify the performance of this cooling module, the authors measured the thermal resistance and carried out reliability tests. Through this verification, they confirmed that the module cuts the thermal resistance by about 30% compared with the generally-used parallel flat-plate fin (having the same volume as the low-profile heat pipe module) and that it presents no problem in terms of long-term reliability. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | High heat output LSIs / cooling / heat pipe / fin / thermal resistance |
| Paper # | R98-39 |
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| Conference Information | |
| Committee | R |
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| Conference Date | 1999/2/19(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of a low-profile heat pipe module as cooing technology |
| Sub Title (in English) | |
| Keyword(1) | High heat output LSIs |
| Keyword(2) | cooling |
| Keyword(3) | heat pipe |
| Keyword(4) | fin |
| Keyword(5) | thermal resistance |
| 1st Author's Name | Kouichi Fukumiya |
| 1st Author's Affiliation | Telecommunications Division, Hitachi, Ltd.() |
| 2nd Author's Name | Shinya Hamagishi |
| 2nd Author's Affiliation | Telecommunications Division, Hitachi, Ltd. |
| 3rd Author's Name | Seiji Karashima |
| 3rd Author's Affiliation | Telecommunications Division, Hitachi, Ltd. |
| 4th Author's Name | Hiroshi Kuwaki |
| 4th Author's Affiliation | Telecommunications Division, Hitachi, Ltd. |
| 5th Author's Name | Norio Nakazato |
| 5th Author's Affiliation | Mechanical Engineering Research Laboratory, Hitachi, Ltd. |
| Date | 1999/2/19 |
| Paper # | R98-39 |
| Volume (vol) | vol.98 |
| Number (no) | 612 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |