| Presentation | 1994/11/18 Electromigration Lifetime of Interconection with Via Shinji Nakano, Tetsuaki Wada, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The dependence of electromigration(EM)lifetime on metal stepcoverage were investigated by two kinds of test patterns.Via chain pattern and the simulated product's pattern with via were compared.Three different types of samples for the stepcoverage at via were used in each pattern.The stepcoverage at via was improved by appling hot sputter and wet & dry etcfiing. As a result of investigation,the following facts were found.In the test of via chain,the EM lifetime strongly depends on metal stepcoverage at via.On the other hand,in the case of the simulated product's pattern with via,the EM lifetime is not related to the metal stepcoverage at via. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | electromigration / via hole / stepcoverage / multi-layered interconnects |
| Paper # | R94-42 |
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| Conference Information | |
| Committee | R |
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| Conference Date | 1994/11/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Electromigration Lifetime of Interconection with Via |
| Sub Title (in English) | |
| Keyword(1) | electromigration |
| Keyword(2) | via hole |
| Keyword(3) | stepcoverage |
| Keyword(4) | multi-layered interconnects |
| 1st Author's Name | Shinji Nakano |
| 1st Author's Affiliation | Matsushita Electronics Corporation() |
| 2nd Author's Name | Tetsuaki Wada |
| 2nd Author's Affiliation | Matsushita Electronics Corporation |
| Date | 1994/11/18 |
| Paper # | R94-42 |
| Volume (vol) | vol.94 |
| Number (no) | 352 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |