Presentation 1995/5/19
Outlines of The 20th ISTFA
Toshinori Muto, Hideo Okamoto,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Outlines of The 20th ISTFA are described in this paper. The subjects discussed are of technical trends in the field of failure analyses of devices, in particular, of semiconductor devices. A large number of successful results has been reported on analyses by means of newly developed instruments. A new wet chemical etching method has also been proposed as an effective means for structural analysis of ICs without any damage on the electronic performance of ICs. Invaluable field data on long term package integrity has been discussed on ICs and discrete transistors. Failure analysis business has been positioned to be a kind of "Re-engineering and discussed as a link in the chain of Total Quality Management.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Failure analysis / Failure mechanism / Chem / etching / Re-engineering / Sealing
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Conference Date 1995/5/19(1days)
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Title (in Japanese) (See Japanese page)
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Title (in English) Outlines of The 20th ISTFA
Sub Title (in English)
Keyword(1) Failure analysis
Keyword(2) Failure mechanism
Keyword(3) Chem
Keyword(4) etching
Keyword(5) Re-engineering
Keyword(6) Sealing /
1st Author's Name Toshinori Muto
1st Author's Affiliation HIREC()
2nd Author's Name Hideo Okamoto
2nd Author's Affiliation OKI Engineering CO., Ltd.
Date 1995/5/19
Paper #
Volume (vol) vol.95
Number (no) 45
Page pp.pp.-
#Pages 6
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