Presentation | 1995/5/19 Outlines of The 20th ISTFA Toshinori Muto, Hideo Okamoto, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Outlines of The 20th ISTFA are described in this paper. The subjects discussed are of technical trends in the field of failure analyses of devices, in particular, of semiconductor devices. A large number of successful results has been reported on analyses by means of newly developed instruments. A new wet chemical etching method has also been proposed as an effective means for structural analysis of ICs without any damage on the electronic performance of ICs. Invaluable field data on long term package integrity has been discussed on ICs and discrete transistors. Failure analysis business has been positioned to be a kind of "Re-engineering and discussed as a link in the chain of Total Quality Management. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Failure analysis / Failure mechanism / Chem / etching / Re-engineering / Sealing |
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Conference Information | |
Committee | R |
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Conference Date | 1995/5/19(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Reliability(R) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Outlines of The 20th ISTFA |
Sub Title (in English) | |
Keyword(1) | Failure analysis |
Keyword(2) | Failure mechanism |
Keyword(3) | Chem |
Keyword(4) | etching |
Keyword(5) | Re-engineering |
Keyword(6) | Sealing / |
1st Author's Name | Toshinori Muto |
1st Author's Affiliation | HIREC() |
2nd Author's Name | Hideo Okamoto |
2nd Author's Affiliation | OKI Engineering CO., Ltd. |
Date | 1995/5/19 |
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Volume (vol) | vol.95 |
Number (no) | 45 |
Page | pp.pp.- |
#Pages | 6 |
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