Presentation | 1998/3/13 High Accuracy Backside Emission Microscopy in a LSI Chip by CAD Layout Pattern Overlay Tatsuya Ishii, Koji Azamawari, Norio Asatani, Jun-ichi Mitsuhashi, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | In the backside emission microscopy for failure analysis of LSIs with the multi-level metallization process, flip-chip technology and CSP/LOC package, decrease of chip image contrast and/or resolution becomes the recognizing of photo emission site more difficult. CAD layout pattern overlay technique has been developed for high accurate recognition of photo emitting point. The quarter micron level accuracy of recognizing emitting site has been achieved by three point alignment method on the software. We show this technique is effective for actual failure analysis using advanced DRAM application. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | silicon LSI / failure analysis / emission microscopy / fault isolation / CAD linkage |
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Committee | R |
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Conference Date | 1998/3/13(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Registration To | Reliability(R) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | High Accuracy Backside Emission Microscopy in a LSI Chip by CAD Layout Pattern Overlay |
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Keyword(1) | silicon LSI |
Keyword(2) | failure analysis |
Keyword(3) | emission microscopy |
Keyword(4) | fault isolation |
Keyword(5) | CAD linkage |
1st Author's Name | Tatsuya Ishii |
1st Author's Affiliation | Semiconductor Group Manufacturing Technology Div.Mitsubishi Electric Corp.() |
2nd Author's Name | Koji Azamawari |
2nd Author's Affiliation | Semiconductor Works Tada Eiectric Corp. |
3rd Author's Name | Norio Asatani |
3rd Author's Affiliation | Semiconductor Group Manufacturing Technology Div.Mitsubishi Electric Corp. |
4th Author's Name | Jun-ichi Mitsuhashi |
4th Author's Affiliation | Semiconductor Group Manufacturing Technology Div.Mitsubishi Electric Corp. |
Date | 1998/3/13 |
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Volume (vol) | vol.97 |
Number (no) | 600 |
Page | pp.pp.- |
#Pages | 6 |
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