Presentation | 1997/12/12 LSI Failure Analysis Technology using Cross-sectional TEM Technique Shinji Nakamura, Takemi Ueki, Yukio Komine, Tadao Takeda, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | A powerful specimen-preparation technique for cross-sectional TEM in LSI failure analysis has been developed. This technique consists of (a) a low damage grinding method to groove with little chipping, (b) a highly accurate alignment method for FIB fabrication with simultaneous SEM observation and a simulation tool to indicate the specified cross-sectional image, and (c) a determination method of three-dimensional coordinates of defects in thick specimens using the ultra high voltage TEM. The efficiency of this technique is demonstrated by applying it to failure analysis of 0.25-μm CMOS devices. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | LSI Failure analysis / Microstructure analysis / X-TEM / FIB / SEM |
Paper # | R97-28 |
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Committee | R |
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Conference Date | 1997/12/12(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Reliability(R) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | LSI Failure Analysis Technology using Cross-sectional TEM Technique |
Sub Title (in English) | |
Keyword(1) | LSI Failure analysis |
Keyword(2) | Microstructure analysis |
Keyword(3) | X-TEM |
Keyword(4) | FIB |
Keyword(5) | SEM |
1st Author's Name | Shinji Nakamura |
1st Author's Affiliation | NTT System Electronics Laboratories() |
2nd Author's Name | Takemi Ueki |
2nd Author's Affiliation | NTT Electronics |
3rd Author's Name | Yukio Komine |
3rd Author's Affiliation | NTT System Electronics Laboratories |
4th Author's Name | Tadao Takeda |
4th Author's Affiliation | NTT System Electronics Laboratories |
Date | 1997/12/12 |
Paper # | R97-28 |
Volume (vol) | vol.97 |
Number (no) | 443 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |