Presentation 1997/12/12
Reliability of Printed-Circuit Board insulation by Dew condensation
Hirokazu Tanaka, Yuuichi Aoki, Shigeharu Yamamoto,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) In recent years, troubles has become a problem such as failure of the Printed-Circuit Board between conductors caused by Ion Migration by dew condensation along with the high density surface mounting of electronic equipment and the popularization of portable equipment. To investigate it, new testing equipment and method were developed by the authors, which enable a forced evaporation cycle after deposit and continuous monitoring by CCD camera recorded all the procedure in the chamber. The results are; the gained data can be considered as a reliability model of wear out type statistically the cycle life before the breakdown depends on the growth of wettability of the PCB surface by the repeating cycles of dew condensing/drying.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Dew Condensation / Environmental Test / Ion Migration / Dendrite / Wettability
Paper # R97-27
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Committee R
Conference Date 1997/12/12(1days)
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Registration To Reliability(R)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Reliability of Printed-Circuit Board insulation by Dew condensation
Sub Title (in English)
Keyword(1) Dew Condensation
Keyword(2) Environmental Test
Keyword(3) Ion Migration
Keyword(4) Dendrite
Keyword(5) Wettability
1st Author's Name Hirokazu Tanaka
1st Author's Affiliation TABAI ESPEC CORP. Environmental Test Technical Center()
2nd Author's Name Yuuichi Aoki
2nd Author's Affiliation TABAI ESPEC CORP. Environmental Test Technical Center
3rd Author's Name Shigeharu Yamamoto
3rd Author's Affiliation TABAI ESPEC CORP. Environmental Test Technical Center
Date 1997/12/12
Paper # R97-27
Volume (vol) vol.97
Number (no) 443
Page pp.pp.-
#Pages 6
Date of Issue