Presentation | 1997/12/12 Reliability of Printed-Circuit Board insulation by Dew condensation Hirokazu Tanaka, Yuuichi Aoki, Shigeharu Yamamoto, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | In recent years, troubles has become a problem such as failure of the Printed-Circuit Board between conductors caused by Ion Migration by dew condensation along with the high density surface mounting of electronic equipment and the popularization of portable equipment. To investigate it, new testing equipment and method were developed by the authors, which enable a forced evaporation cycle after deposit and continuous monitoring by CCD camera recorded all the procedure in the chamber. The results are; the gained data can be considered as a reliability model of wear out type statistically the cycle life before the breakdown depends on the growth of wettability of the PCB surface by the repeating cycles of dew condensing/drying. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Dew Condensation / Environmental Test / Ion Migration / Dendrite / Wettability |
Paper # | R97-27 |
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Conference Information | |
Committee | R |
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Conference Date | 1997/12/12(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
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Assistant |
Paper Information | |
Registration To | Reliability(R) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Reliability of Printed-Circuit Board insulation by Dew condensation |
Sub Title (in English) | |
Keyword(1) | Dew Condensation |
Keyword(2) | Environmental Test |
Keyword(3) | Ion Migration |
Keyword(4) | Dendrite |
Keyword(5) | Wettability |
1st Author's Name | Hirokazu Tanaka |
1st Author's Affiliation | TABAI ESPEC CORP. Environmental Test Technical Center() |
2nd Author's Name | Yuuichi Aoki |
2nd Author's Affiliation | TABAI ESPEC CORP. Environmental Test Technical Center |
3rd Author's Name | Shigeharu Yamamoto |
3rd Author's Affiliation | TABAI ESPEC CORP. Environmental Test Technical Center |
Date | 1997/12/12 |
Paper # | R97-27 |
Volume (vol) | vol.97 |
Number (no) | 443 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |