| Presentation | 1997/10/30 Study on LSIs Aluminum interconnection of evaluation methods Shigeki Kikui, Kenji Sugimoto, Kazuhiro Matsuzaki, Sumio Matsuda, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | To apply commercial LSIs which are fabricated with half-micron design rule, one of the most serious problems on reliability is the evaluation method of its Electromigration in Aluminum interconnection. We researched and study on Electromigration evaluation methods of LSIs Aluminum interconnection. In this paper, we studied the evaluation factors on manufacturing process. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Electromigration |
| Paper # | R97-14 |
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| Conference Information | |
| Committee | R |
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| Conference Date | 1997/10/30(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study on LSIs Aluminum interconnection of evaluation methods |
| Sub Title (in English) | |
| Keyword(1) | Electromigration |
| 1st Author's Name | Shigeki Kikui |
| 1st Author's Affiliation | National Space Development Agency of Japan() |
| 2nd Author's Name | Kenji Sugimoto |
| 2nd Author's Affiliation | National Space Development Agency of Japan |
| 3rd Author's Name | Kazuhiro Matsuzaki |
| 3rd Author's Affiliation | National Space Development Agency of Japan |
| 4th Author's Name | Sumio Matsuda |
| 4th Author's Affiliation | National Space Development Agency of Japan |
| Date | 1997/10/30 |
| Paper # | R97-14 |
| Volume (vol) | vol.97 |
| Number (no) | 351 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |