| Presentation | 1996/12/13 Evaluation of the Stability of the Au Interconnection Buried in the Polyimide Layer Hirohiko Sugahara, Masakatsu Kimizuka, Yoshino Fukai, Makoto Hirano, Kiyoshi Ogawa, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The stability of the electrical characteristics of the three-dimensional interconnection composed of the Au/WSiN metal layers and the polyimide insulator layers is studied. Temperature cycle tests for the contact chains and high-temperature bias stress tests for the Au interconnection and for GaAs MESFETs covered with polyimide layer are carried out to confirm whether new degradation phenomena are observed or not for this system. The increase in the contact resistance at the through-hole contact due to the thermal expansion coefficient difference between the polyimide and the metal is not observed. There is no polyimide leakage current increase caused by water. Stable electrical characteristics of the Au interconnection and MESFETs buried in the polyimide layer exhibit fairly high stability of this system. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | interconnection / gold / polyimide / reliability |
| Paper # | R96-32 |
| Date of Issue |
| Conference Information | |
| Committee | R |
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| Conference Date | 1996/12/13(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Evaluation of the Stability of the Au Interconnection Buried in the Polyimide Layer |
| Sub Title (in English) | |
| Keyword(1) | interconnection |
| Keyword(2) | gold |
| Keyword(3) | polyimide |
| Keyword(4) | reliability |
| 1st Author's Name | Hirohiko Sugahara |
| 1st Author's Affiliation | NTT System Electronics Laboratories() |
| 2nd Author's Name | Masakatsu Kimizuka |
| 2nd Author's Affiliation | NTT System Electronics Laboratories |
| 3rd Author's Name | Yoshino Fukai |
| 3rd Author's Affiliation | NTT System Electronics Laboratories |
| 4th Author's Name | Makoto Hirano |
| 4th Author's Affiliation | NTT System Electronics Laboratories |
| 5th Author's Name | Kiyoshi Ogawa |
| 5th Author's Affiliation | NTT Electronics Technology |
| Date | 1996/12/13 |
| Paper # | R96-32 |
| Volume (vol) | vol.96 |
| Number (no) | 423 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |