| Presentation | 2002/1/11 Research and Development of Opto-electronics Packaging : Active interposer module Takeshi ISHITSUKA, Masao KINOSHITA, Kenji HIRUMA, Masahiro OKABE, Seiki HIRAMATSU, Hideto FURUYAMA, Takashi MIKAWA, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Progress of Active interposer (AIP) which is conversion module between electrical and optical signal is described. AIP is a module by which LSI, VCSEL, and the driver, etc. are three-dimensionally mounted on the interposer substrate, and which is one of development technologies of national project "Research and Development for Super High-density Electronics System Integration". The model was made for trial purposes aiming at the confirmation of a fundamental structure, and the signal transmission characteristic was evaluated. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | active interposer / SiP / three dimensional mounting / opto-electronics packaging |
| Paper # | 2001-EMD-90 |
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| Conference Information | |
| Committee | EMD |
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| Conference Date | 2002/1/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Research and Development of Opto-electronics Packaging : Active interposer module |
| Sub Title (in English) | |
| Keyword(1) | active interposer |
| Keyword(2) | SiP |
| Keyword(3) | three dimensional mounting |
| Keyword(4) | opto-electronics packaging |
| 1st Author's Name | Takeshi ISHITSUKA |
| 1st Author's Affiliation | Electronic System Integration Technology Research Department, Association of Super-Advanced of Electronics Technology (ASET)() |
| 2nd Author's Name | Masao KINOSHITA |
| 2nd Author's Affiliation | Electronic System Integration Technology Research Department, Association of Super-Advanced of Electronics Technology (ASET) |
| 3rd Author's Name | Kenji HIRUMA |
| 3rd Author's Affiliation | Electronic System Integration Technology Research Department, Association of Super-Advanced of Electronics Technology (ASET) |
| 4th Author's Name | Masahiro OKABE |
| 4th Author's Affiliation | Electronic System Integration Technology Research Department, Association of Super-Advanced of Electronics Technology (ASET) |
| 5th Author's Name | Seiki HIRAMATSU |
| 5th Author's Affiliation | Electronic System Integration Technology Research Department, Association of Super-Advanced of Electronics Technology (ASET) |
| 6th Author's Name | Hideto FURUYAMA |
| 6th Author's Affiliation | Electronic System Integration Technology Research Department, Association of Super-Advanced of Electronics Technology (ASET) |
| 7th Author's Name | Takashi MIKAWA |
| 7th Author's Affiliation | Electronic System Integration Technology Research Department, Association of Super-Advanced of Electronics Technology (ASET) |
| Date | 2002/1/11 |
| Paper # | 2001-EMD-90 |
| Volume (vol) | vol.101 |
| Number (no) | 570 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |