Presentation 2001/8/17
Opto-electronic chip-on-film packaging technology using low-CTE film waveguides
Shigeki Ishibashi,
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Abstract(in English) We have developed a new type of polyimide optical waveguide film with a low coefficient of thermal expansion(CTE). Using the low-CTE polyimide waveguides and AuSn microsolder bump bonding technology, we made a prototype optical transmitter submodule. We measured the optical properties of the film waveguides, the shear strength of the bonds, and the alignments between the optical chips and the waveguide cores, and found the opto-electric chip-on-film package can be realized using these technologies.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Polyimide / waveguide / thermal expansion / optical packaging / solder bump / COP
Paper # EMD2001-38,CPM2001-64,OPE2001-57,LQE2001-56
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Conference Information
Committee EMD
Conference Date 2001/8/17(1days)
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Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Opto-electronic chip-on-film packaging technology using low-CTE film waveguides
Sub Title (in English)
Keyword(1) Polyimide
Keyword(2) waveguide
Keyword(3) thermal expansion
Keyword(4) optical packaging
Keyword(5) solder bump
Keyword(6) COP
1st Author's Name Shigeki Ishibashi
1st Author's Affiliation NTT Telecommunications Energy Laboratories, NTT Corporation()
Date 2001/8/17
Paper # EMD2001-38,CPM2001-64,OPE2001-57,LQE2001-56
Volume (vol) vol.101
Number (no) 256
Page pp.pp.-
#Pages 4
Date of Issue