| Presentation | 2001/8/17 Opto-electronic chip-on-film packaging technology using low-CTE film waveguides Shigeki Ishibashi, |
|---|---|
| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We have developed a new type of polyimide optical waveguide film with a low coefficient of thermal expansion(CTE). Using the low-CTE polyimide waveguides and AuSn microsolder bump bonding technology, we made a prototype optical transmitter submodule. We measured the optical properties of the film waveguides, the shear strength of the bonds, and the alignments between the optical chips and the waveguide cores, and found the opto-electric chip-on-film package can be realized using these technologies. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Polyimide / waveguide / thermal expansion / optical packaging / solder bump / COP |
| Paper # | EMD2001-38,CPM2001-64,OPE2001-57,LQE2001-56 |
| Date of Issue |
| Conference Information | |
| Committee | EMD |
|---|---|
| Conference Date | 2001/8/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Opto-electronic chip-on-film packaging technology using low-CTE film waveguides |
| Sub Title (in English) | |
| Keyword(1) | Polyimide |
| Keyword(2) | waveguide |
| Keyword(3) | thermal expansion |
| Keyword(4) | optical packaging |
| Keyword(5) | solder bump |
| Keyword(6) | COP |
| 1st Author's Name | Shigeki Ishibashi |
| 1st Author's Affiliation | NTT Telecommunications Energy Laboratories, NTT Corporation() |
| Date | 2001/8/17 |
| Paper # | EMD2001-38,CPM2001-64,OPE2001-57,LQE2001-56 |
| Volume (vol) | vol.101 |
| Number (no) | 256 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |