Presentation | 2001/6/29 Observation of Semiconductor Bonded Films on Piezoelectric substrates by X-Ray diffraction Ken-ichiro Miyadai, Tsutomu Nakajima, Yusuke Aoki, Kohji Hohkawa, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Surface acoustic wave (SAW) -semiconductor coupled devices are attractive for realization of high performance and new functional devices. In this paper, we show a process technology for fabrication of SAW-semiconductor coupled device. Especially, we examined a stress of bonded semiconductor films, which were heated to obtain strong bonding strength between a semiconductor films and piezoeloctric substrate, by X-ray diffraction method. We clarified the stress distribution of GaAs bonded films. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | ELO film bonding / SAW device / GaAs / heating process / stress distribution |
Paper # | US2001-27,EMD2001-19,CPM2001-34,OME2001-29 |
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Committee | EMD |
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Conference Date | 2001/6/29(1days) |
Place (in Japanese) | (See Japanese page) |
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Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Observation of Semiconductor Bonded Films on Piezoelectric substrates by X-Ray diffraction |
Sub Title (in English) | |
Keyword(1) | ELO film bonding |
Keyword(2) | SAW device |
Keyword(3) | GaAs |
Keyword(4) | heating process |
Keyword(5) | stress distribution |
1st Author's Name | Ken-ichiro Miyadai |
1st Author's Affiliation | Kanagawa Institute of Technology() |
2nd Author's Name | Tsutomu Nakajima |
2nd Author's Affiliation | Kanagawa Institute of Technology |
3rd Author's Name | Yusuke Aoki |
3rd Author's Affiliation | Kanagawa Institute of Technology |
4th Author's Name | Kohji Hohkawa |
4th Author's Affiliation | Kanagawa Institute of Technology |
Date | 2001/6/29 |
Paper # | US2001-27,EMD2001-19,CPM2001-34,OME2001-29 |
Volume (vol) | vol.101 |
Number (no) | 169 |
Page | pp.pp.- |
#Pages | 6 |
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