| Presentation | 2000/12/8 Development of High Density Build-up Substrate by Via Filling Takashi Nakamura, Tetsuro Hamada, Toshikazu Okubo, Toshiaki Ishii, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The build-up method is suitable for making semiconductor substrates because high density patterns can be made. Higher density build-up substrates can be made by using the via filling method. The crystal orientation of the plated copper film from the bath for via filling is different from that from the conventional orcinary bath. However, filled via has the same electrical properties as ordinary conformable via. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Build-up / Via filling / Crystal orientation / Electrical property |
| Paper # | EMD2000-76 |
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| Conference Information | |
| Committee | EMD |
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| Conference Date | 2000/12/8(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of High Density Build-up Substrate by Via Filling |
| Sub Title (in English) | |
| Keyword(1) | Build-up |
| Keyword(2) | Via filling |
| Keyword(3) | Crystal orientation |
| Keyword(4) | Electrical property |
| 1st Author's Name | Takashi Nakamura |
| 1st Author's Affiliation | Toppan Printing Co., Ltd., Electronics Research Laboratory() |
| 2nd Author's Name | Tetsuro Hamada |
| 2nd Author's Affiliation | Toppan Printing Co., Ltd., Electronics Research Laboratory |
| 3rd Author's Name | Toshikazu Okubo |
| 3rd Author's Affiliation | Toppan Printing Co., Ltd., Electronics Research Laboratory |
| 4th Author's Name | Toshiaki Ishii |
| 4th Author's Affiliation | Toppan Printing Co., Ltd., Electronics Research Laboratory |
| Date | 2000/12/8 |
| Paper # | EMD2000-76 |
| Volume (vol) | vol.100 |
| Number (no) | 511 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |