Presentation 2000/12/8
Materials of wiring boards for high-speed performance and recent trends in developemt
Shigeo Sase,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Wiring boards are expected to match with faster operation as electric information instruments are increasing their performance. Materials of low dieplectric constant are needed for decreasing the propagation delay time on wiring boards. One of the epoxy materials was developed for the cost-effective low dielectric constant wiring board. Materials of low dissipation factor are being requireed because the attenuation on wiring board is more the serious as the MPU's clock speed becomes the faster.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Wiring board / Propagation delay time / Dielectric constant / Clock speed / Dissipation factor / Transmission loss
Paper # EMD2000-75
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Conference Information
Committee EMD
Conference Date 2000/12/8(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Materials of wiring boards for high-speed performance and recent trends in developemt
Sub Title (in English)
Keyword(1) Wiring board
Keyword(2) Propagation delay time
Keyword(3) Dielectric constant
Keyword(4) Clock speed
Keyword(5) Dissipation factor
Keyword(6) Transmission loss
1st Author's Name Shigeo Sase
1st Author's Affiliation Research & Development Center, Hitachi Chemical Co.Ltd.()
Date 2000/12/8
Paper # EMD2000-75
Volume (vol) vol.100
Number (no) 511
Page pp.pp.-
#Pages 4
Date of Issue