Presentation | 2000/12/8 Materials of wiring boards for high-speed performance and recent trends in developemt Shigeo Sase, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Wiring boards are expected to match with faster operation as electric information instruments are increasing their performance. Materials of low dieplectric constant are needed for decreasing the propagation delay time on wiring boards. One of the epoxy materials was developed for the cost-effective low dielectric constant wiring board. Materials of low dissipation factor are being requireed because the attenuation on wiring board is more the serious as the MPU's clock speed becomes the faster. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Wiring board / Propagation delay time / Dielectric constant / Clock speed / Dissipation factor / Transmission loss |
Paper # | EMD2000-75 |
Date of Issue |
Conference Information | |
Committee | EMD |
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Conference Date | 2000/12/8(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Materials of wiring boards for high-speed performance and recent trends in developemt |
Sub Title (in English) | |
Keyword(1) | Wiring board |
Keyword(2) | Propagation delay time |
Keyword(3) | Dielectric constant |
Keyword(4) | Clock speed |
Keyword(5) | Dissipation factor |
Keyword(6) | Transmission loss |
1st Author's Name | Shigeo Sase |
1st Author's Affiliation | Research & Development Center, Hitachi Chemical Co.Ltd.() |
Date | 2000/12/8 |
Paper # | EMD2000-75 |
Volume (vol) | vol.100 |
Number (no) | 511 |
Page | pp.pp.- |
#Pages | 4 |
Date of Issue |