Presentation 2000/6/9
A Study on Iridium Contact Reed Switches
Kazuya Yokoyama, Tatsuo Kobayashi,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) In the electronics field, the ever-increasing pressure for miniaturization and high density mounts has had a direct impact on the size of components. From its beginnings as a telecommunications solution, the reed switch has made outstanding progress in miniaturization. However, this has conversely led to the decrease in contact force and thus increased difficulty in maintaining contact capabilities. In this paper, we examined the use of iridium, which has never been used in a reed switch, as a contact material, and put it into operational tests to determine its effectiveness as a solution for the deterioration of contact capability caused by miniaturization. The tests were run at a load of DC10V-0.1A (1W). As a result, we have found that iridium performs better than rhodium and is a viable material for miniature reed switch contacts.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Iridium / Platinum metals / Reed switch / Contact force
Paper # EDM2000-18
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Conference Information
Committee EMD
Conference Date 2000/6/9(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study on Iridium Contact Reed Switches
Sub Title (in English)
Keyword(1) Iridium
Keyword(2) Platinum metals
Keyword(3) Reed switch
Keyword(4) Contact force
1st Author's Name Kazuya Yokoyama
1st Author's Affiliation Oki Sensor Device Corporation()
2nd Author's Name Tatsuo Kobayashi
2nd Author's Affiliation Oki Sensor Device Corporation
Date 2000/6/9
Paper # EDM2000-18
Volume (vol) vol.100
Number (no) 110
Page pp.pp.-
#Pages 6
Date of Issue