| Presentation | 1999/4/16 Study on the formed package lead for high speed devices Yuji Fujita, Hideyuki Serizawa, Kazuyoshi Yamaki, Kazuhide Harada, Satoshi Yoshida, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper reports about investigations on the formed package lead for high speed devices. To reduce the cost of module, we desided to use the small-sized ceramic substrate. The stress at the lead between the package and printed wiring board must be reduced to meet the reliability target. We reformed the shape of the lead and certified the reliability of the module. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | package / high speed / solder / lead |
| Paper # | EMD99-2 |
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| Conference Information | |
| Committee | EMD |
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| Conference Date | 1999/4/16(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study on the formed package lead for high speed devices |
| Sub Title (in English) | |
| Keyword(1) | package |
| Keyword(2) | high speed |
| Keyword(3) | solder |
| Keyword(4) | lead |
| 1st Author's Name | Yuji Fujita |
| 1st Author's Affiliation | Hitachi, Ltd. Production Engineering Research Laboratory() |
| 2nd Author's Name | Hideyuki Serizawa |
| 2nd Author's Affiliation | Hitachi, Ltd. Telecommunication Division |
| 3rd Author's Name | Kazuyoshi Yamaki |
| 3rd Author's Affiliation | Hitachi, Ltd. Telecommunication Division |
| 4th Author's Name | Kazuhide Harada |
| 4th Author's Affiliation | Hitachi, Ltd. Telecommunication Division |
| 5th Author's Name | Satoshi Yoshida |
| 5th Author's Affiliation | Hitachi, Ltd. Production Engineering Research Laboratory |
| Date | 1999/4/16 |
| Paper # | EMD99-2 |
| Volume (vol) | vol.99 |
| Number (no) | 9 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |