Presentation 1999/4/16
Reliability of Lead-Free Solders
Seiji KARASHIMA, Yuzo IWANAGA, Shinya HAMAGISHI, Nobuhide TAKANO, Ryoji MUTO, Nobuyuki URA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This article reports the results on assessment of lead-free solder reliability. Lead-free solder assessed were Sn-Ag-Bi-Cu, Sn-Ag-Cu-In, and Sn-Ag-Cu. These solders were examined accelerated high temperature test. As a result, the growth of Sn-Cu in Sn-Ag-Bi-Cu was more quickly than the growth of Sn-Cu in other solders.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Sn-Ag-Cu-Bi / Sn-Ag-Cu-In / Sn-Ag-Cu / high temperature test / lead-free solder / Pb-free solder
Paper # EMD99-1
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Conference Information
Committee EMD
Conference Date 1999/4/16(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Reliability of Lead-Free Solders
Sub Title (in English)
Keyword(1) Sn-Ag-Cu-Bi
Keyword(2) Sn-Ag-Cu-In
Keyword(3) Sn-Ag-Cu
Keyword(4) high temperature test
Keyword(5) lead-free solder
Keyword(6) Pb-free solder
1st Author's Name Seiji KARASHIMA
1st Author's Affiliation Telecommunication Division, Hitachi, Ltd.()
2nd Author's Name Yuzo IWANAGA
2nd Author's Affiliation Telecommunication Division, Hitachi, Ltd.
3rd Author's Name Shinya HAMAGISHI
3rd Author's Affiliation Telecommunication Division, Hitachi, Ltd.
4th Author's Name Nobuhide TAKANO
4th Author's Affiliation Telecommunication Division, Hitachi, Ltd.
5th Author's Name Ryoji MUTO
5th Author's Affiliation Telecommunication Division, Hitachi, Ltd.
6th Author's Name Nobuyuki URA
6th Author's Affiliation Telecommunication Division, Hitachi, Ltd.
Date 1999/4/16
Paper # EMD99-1
Volume (vol) vol.99
Number (no) 9
Page pp.pp.-
#Pages 6
Date of Issue