Presentation | 1999/4/16 Reliability of Lead-Free Solders Seiji KARASHIMA, Yuzo IWANAGA, Shinya HAMAGISHI, Nobuhide TAKANO, Ryoji MUTO, Nobuyuki URA, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | This article reports the results on assessment of lead-free solder reliability. Lead-free solder assessed were Sn-Ag-Bi-Cu, Sn-Ag-Cu-In, and Sn-Ag-Cu. These solders were examined accelerated high temperature test. As a result, the growth of Sn-Cu in Sn-Ag-Bi-Cu was more quickly than the growth of Sn-Cu in other solders. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Sn-Ag-Cu-Bi / Sn-Ag-Cu-In / Sn-Ag-Cu / high temperature test / lead-free solder / Pb-free solder |
Paper # | EMD99-1 |
Date of Issue |
Conference Information | |
Committee | EMD |
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Conference Date | 1999/4/16(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Reliability of Lead-Free Solders |
Sub Title (in English) | |
Keyword(1) | Sn-Ag-Cu-Bi |
Keyword(2) | Sn-Ag-Cu-In |
Keyword(3) | Sn-Ag-Cu |
Keyword(4) | high temperature test |
Keyword(5) | lead-free solder |
Keyword(6) | Pb-free solder |
1st Author's Name | Seiji KARASHIMA |
1st Author's Affiliation | Telecommunication Division, Hitachi, Ltd.() |
2nd Author's Name | Yuzo IWANAGA |
2nd Author's Affiliation | Telecommunication Division, Hitachi, Ltd. |
3rd Author's Name | Shinya HAMAGISHI |
3rd Author's Affiliation | Telecommunication Division, Hitachi, Ltd. |
4th Author's Name | Nobuhide TAKANO |
4th Author's Affiliation | Telecommunication Division, Hitachi, Ltd. |
5th Author's Name | Ryoji MUTO |
5th Author's Affiliation | Telecommunication Division, Hitachi, Ltd. |
6th Author's Name | Nobuyuki URA |
6th Author's Affiliation | Telecommunication Division, Hitachi, Ltd. |
Date | 1999/4/16 |
Paper # | EMD99-1 |
Volume (vol) | vol.99 |
Number (no) | 9 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |