| Presentation | 1998/6/19 Photonics Intensive Packaging System (φ-PAS) Shinji Koike, Yoshimitsu Arai, Yasuhiro Ando, |
|---|---|
| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Introduction of massive photonics medium to the system makes the new problems emerge such as high-density packaging and system-operation for media like optical fiber, optical waveguides, etc.. We have proposed a new bookshelf packaging-configuration intensified optical interconnection, or Photonics Intensive Packaging System (φ-PAS). The φ-PAS consists of two main key technologies as follows : 1) Flexible fibre wiring boards (F-FWB) has the characteristics of realizing precise wiring using the computer aided design. This technique can incorporate the large volume of optical fiber into the packaging system by cutting off the extra length of optical fiber and covering patterns of some complicated routings on a piece of sheet. 2) One-action optical connection system using sliding mechanism has been incorporated onto bookshelf packaging unit for connection between optical fibers of each boards. The sliding mechanism can connect ～100 optical fibers per a circuit board in one-action by manipulating the lever in front of the unit. This technology has enabled to improve the maintenance for connecting massive volume of optical fibers. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Bookshelf packaging system / Flexible fiber wiring board (F-FWB) / Optical packaging / One-action optical connection system using sliding mechanism / Optical interconnection |
| Paper # | EMD98-13 |
| Date of Issue |
| Conference Information | |
| Committee | EMD |
|---|---|
| Conference Date | 1998/6/19(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Photonics Intensive Packaging System (φ-PAS) |
| Sub Title (in English) | |
| Keyword(1) | Bookshelf packaging system |
| Keyword(2) | Flexible fiber wiring board (F-FWB) |
| Keyword(3) | Optical packaging |
| Keyword(4) | One-action optical connection system using sliding mechanism |
| Keyword(5) | Optical interconnection |
| 1st Author's Name | Shinji Koike |
| 1st Author's Affiliation | NTT Opto-electronics Labs.() |
| 2nd Author's Name | Yoshimitsu Arai |
| 2nd Author's Affiliation | NTT Opto-electronics Labs. |
| 3rd Author's Name | Yasuhiro Ando |
| 3rd Author's Affiliation | NTT Opto-electronics Labs. |
| Date | 1998/6/19 |
| Paper # | EMD98-13 |
| Volume (vol) | vol.98 |
| Number (no) | 134 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |