Presentation | 1994/8/19 Ceramic flat packages for high speed and high frequency devices Kinji Nagata, Takaharu Miyamoto, Fumio Miyagawa, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Ceramic flat package of 72-leads for high-speed and high- frequency devices was developed.By characteristic impedance matching of transmission lines,it was reduced noises because of signal reflection.And we investigated the S parameters of pseudo rectangular coaxial structure formed by via poles,which was necessary to reduce crosstalk,by using model samples.We fabricated ceramic flat package,combination of pseudo rectangular coaxial structure and coplanar waveguide with lower ground plane,and obtained characteristics of insertion loss S_21>≧-1dB,return loss S_11>≦-15dB up to 25 GHz. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | packages / pseudo rectangular coaxial structure / characteristic impedance / S parametes |
Paper # | EMD94-41,CPM94-55,OPE94-50 |
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Conference Information | |
Committee | EMD |
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Conference Date | 1994/8/19(1days) |
Place (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Ceramic flat packages for high speed and high frequency devices |
Sub Title (in English) | |
Keyword(1) | packages |
Keyword(2) | pseudo rectangular coaxial structure |
Keyword(3) | characteristic impedance |
Keyword(4) | S parametes |
1st Author's Name | Kinji Nagata |
1st Author's Affiliation | Research & Development department,Research & Development division, Shinko Electric Industries() |
2nd Author's Name | Takaharu Miyamoto |
2nd Author's Affiliation | Research & Development department,Research & Development division, Shinko Electric Industries |
3rd Author's Name | Fumio Miyagawa |
3rd Author's Affiliation | Research & Development department,Research & Development division, Shinko Electric Industries |
Date | 1994/8/19 |
Paper # | EMD94-41,CPM94-55,OPE94-50 |
Volume (vol) | vol.94 |
Number (no) | 195 |
Page | pp.pp.- |
#Pages | 6 |
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