Presentation 1994/8/19
Ceramic flat packages for high speed and high frequency devices
Kinji Nagata, Takaharu Miyamoto, Fumio Miyagawa,
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Abstract(in English) Ceramic flat package of 72-leads for high-speed and high- frequency devices was developed.By characteristic impedance matching of transmission lines,it was reduced noises because of signal reflection.And we investigated the S parameters of pseudo rectangular coaxial structure formed by via poles,which was necessary to reduce crosstalk,by using model samples.We fabricated ceramic flat package,combination of pseudo rectangular coaxial structure and coplanar waveguide with lower ground plane,and obtained characteristics of insertion loss S_21>≧-1dB,return loss S_11>≦-15dB up to 25 GHz.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) packages / pseudo rectangular coaxial structure / characteristic impedance / S parametes
Paper # EMD94-41,CPM94-55,OPE94-50
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Committee EMD
Conference Date 1994/8/19(1days)
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Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Ceramic flat packages for high speed and high frequency devices
Sub Title (in English)
Keyword(1) packages
Keyword(2) pseudo rectangular coaxial structure
Keyword(3) characteristic impedance
Keyword(4) S parametes
1st Author's Name Kinji Nagata
1st Author's Affiliation Research & Development department,Research & Development division, Shinko Electric Industries()
2nd Author's Name Takaharu Miyamoto
2nd Author's Affiliation Research & Development department,Research & Development division, Shinko Electric Industries
3rd Author's Name Fumio Miyagawa
3rd Author's Affiliation Research & Development department,Research & Development division, Shinko Electric Industries
Date 1994/8/19
Paper # EMD94-41,CPM94-55,OPE94-50
Volume (vol) vol.94
Number (no) 195
Page pp.pp.-
#Pages 6
Date of Issue