Presentation 1994/8/19
Hybrid integration of laser array and optical fiber array on silicon waferboard
Seimi Sasaki, Kazunori Miura, Tadao Inoue, Mitsuhiro Yano,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We use silicon waferboard as a hybrid integration medium for laser array and optical fiber array.V-grooves and markers are formed on silicon surface for accurate positioning of fibers and lasers,respectively.Laser array is disbonded onto bump electrode, and fiber array is held in V-grooves and fixed by soldering.This assembly technology makes it possible to realize passive coupling between laser array and fiber array.We fabricated 6-channel laser array module using this technology.Optical coupling loss of 8 to 9 dB for 6-channels was obtained at 25℃.And,high temperature stable operation over 150℃ was attained for all channels.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) LD array module / hybrid integration / silicon waferboard / LD array / optical fiber array
Paper # EMD94-29,CPM94-43,OPE94-38
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Committee EMD
Conference Date 1994/8/19(1days)
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Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Hybrid integration of laser array and optical fiber array on silicon waferboard
Sub Title (in English)
Keyword(1) LD array module
Keyword(2) hybrid integration
Keyword(3) silicon waferboard
Keyword(4) LD array
Keyword(5) optical fiber array
1st Author's Name Seimi Sasaki
1st Author's Affiliation Fujitsu Laboratories()
2nd Author's Name Kazunori Miura
2nd Author's Affiliation Fujitsu Laboratories
3rd Author's Name Tadao Inoue
3rd Author's Affiliation Fujitsu Laboratories
4th Author's Name Mitsuhiro Yano
4th Author's Affiliation Fujitsu Laboratories
Date 1994/8/19
Paper # EMD94-29,CPM94-43,OPE94-38
Volume (vol) vol.94
Number (no) 195
Page pp.pp.-
#Pages 6
Date of Issue