Presentation	1995/9/22 The Application of the "Divide-And-Join Method" to Electro-Mechanical-Device Kenzo TAKEI,
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Abstract(in Japanese)	(See Japanese page)
Abstract(in English)	Bunsetsu existent relation, Bunsetsu orifra, Bunsetsu arithmetic of multiplication・division・a spure・a squre root and Bunsetsu arithmetic multiplied simultaneously with three numbers can all be constracted on Divide-And-Join Method. We present the descriptions necessary for an understanding of the fundermental properties of the above new technical terms. Bunsetsu orifra indicates the mechanical device and is productive of Orifra. Orifra fractal and Orifra chaos are also productive of Bunsetsu orifra. The relation between mechanical device, mechanical electro device and electro device are described full
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)	Bunsetsu orifra / Orifra・fractal / Orifra・chaos / Divide-And-Join Method
Paper #	EMD95-35
Date of Issue

Conference Information
Committee	EMD
Conference Date	1995/9/22(1days)
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Paper Information
Registration To	Electromechanical Devices (EMD)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	The Application of the "Divide-And-Join Method" to Electro-Mechanical-Device
Sub Title (in English)
Keyword(1)	Bunsetsu orifra
Keyword(2)	Orifra・fractal
Keyword(3)	Orifra・chaos
Keyword(4)	Divide-And-Join Method
1st Author's Name	Kenzo TAKEI
1st Author's Affiliation	BUNSETSU Research Institute()
Date	1995/9/22
Paper #	EMD95-35
Volume (vol)	vol.95
Number (no)	258
Page	pp.pp.-
#Pages	6
Date of Issue