Presentation | 1996/1/19 A Study of Instantaneous Bonding Technique with Eddy Currents Tomokatsu Aizawa, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | When impulse current from a capacitor bank passes through a one turn flat coil, eddy currents are induced in two thin pieces of copper fixed on the coil. Magnetic pressure acts on the pieces and Joule's heat is generated in them. The pieces can be bonded by the pressure and the heat with or without solder between them. For bonding the area of 5×5mm^2 is required bank energy below 1KJ. This paper describes characteristics of the bonding and the experimental results. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | soldering / welding / bonding / eddy currents / magnetic pressure |
Paper # | EMD95-63 |
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Conference Information | |
Committee | EMD |
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Conference Date | 1996/1/19(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
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Assistant |
Paper Information | |
Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | A Study of Instantaneous Bonding Technique with Eddy Currents |
Sub Title (in English) | |
Keyword(1) | soldering |
Keyword(2) | welding |
Keyword(3) | bonding |
Keyword(4) | eddy currents |
Keyword(5) | magnetic pressure |
1st Author's Name | Tomokatsu Aizawa |
1st Author's Affiliation | Tokyo Metropolitarr College of Technology() |
Date | 1996/1/19 |
Paper # | EMD95-63 |
Volume (vol) | vol.95 |
Number (no) | 472 |
Page | pp.pp.- |
#Pages | 4 |
Date of Issue |