Presentation 1996/1/19
A Study of Instantaneous Bonding Technique with Eddy Currents
Tomokatsu Aizawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) When impulse current from a capacitor bank passes through a one turn flat coil, eddy currents are induced in two thin pieces of copper fixed on the coil. Magnetic pressure acts on the pieces and Joule's heat is generated in them. The pieces can be bonded by the pressure and the heat with or without solder between them. For bonding the area of 5×5mm^2 is required bank energy below 1KJ. This paper describes characteristics of the bonding and the experimental results.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) soldering / welding / bonding / eddy currents / magnetic pressure
Paper # EMD95-63
Date of Issue

Conference Information
Committee EMD
Conference Date 1996/1/19(1days)
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Place (in English)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study of Instantaneous Bonding Technique with Eddy Currents
Sub Title (in English)
Keyword(1) soldering
Keyword(2) welding
Keyword(3) bonding
Keyword(4) eddy currents
Keyword(5) magnetic pressure
1st Author's Name Tomokatsu Aizawa
1st Author's Affiliation Tokyo Metropolitarr College of Technology()
Date 1996/1/19
Paper # EMD95-63
Volume (vol) vol.95
Number (no) 472
Page pp.pp.-
#Pages 4
Date of Issue