Presentation 1995/12/15
Evaluation for Signal Transmission Capability of Interconnection between Packages using Through-type Connector
Masato Nakamura, Nobuaki Sugiura, Katsumi Kaizu, Kei-ichi Yasuda,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) A mid-plane packaging configuration has the advantage for accommodating multi-interface packages. The key point of this configuration is high-speed signal transmission capability between front and rear package boards. We evaluated the signal transmission capability of this configuration from the viewpoint of crosstalk noise and switching noise, and obtained following results: the crosstalk noise is less than 200 mV, the switching noise is from 60 to l00 mV. Still more, we confirmed to be able to connect up to 200 Mbit/s data signal between front and rear package boards by using through-type connector of signal-to-ground pin assignment ratio of 1/1.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) through-type connector / interface / signal transmission / crosstalk noise / switching noise
Paper # EMD95-56
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Committee EMD
Conference Date 1995/12/15(1days)
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Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Evaluation for Signal Transmission Capability of Interconnection between Packages using Through-type Connector
Sub Title (in English)
Keyword(1) through-type connector
Keyword(2) interface
Keyword(3) signal transmission
Keyword(4) crosstalk noise
Keyword(5) switching noise
1st Author's Name Masato Nakamura
1st Author's Affiliation NTT Network Service Systems Laboratories()
2nd Author's Name Nobuaki Sugiura
2nd Author's Affiliation NTT Network Service Systems Laboratories
3rd Author's Name Katsumi Kaizu
3rd Author's Affiliation NTT Network Service Systems Laboratories
4th Author's Name Kei-ichi Yasuda
4th Author's Affiliation NTT Network Service Systems Laboratories
Date 1995/12/15
Paper # EMD95-56
Volume (vol) vol.95
Number (no) 439
Page pp.pp.-
#Pages 6
Date of Issue